Lg Display Co., Ltd.

Lg Philips Lcd Co., Inc.

Dongwoo Fine-chem Co., Ltd.

Dongjin Semichem Co., Ltd.

Kyoung-Mook Lee

Oh-Nam Kwon

Nack-Bong Choi

Gee-Sung Chae

Yong-Sup Hwang

Seung-Hee Nam

Gyoo-Chul Jo

Jae-Young Oh

Cyoo-Chul Jo

Heung-Lyul Cho

Seong-Bae Kim

Suk-Chang Jang

Byung-Uk Kim

Seung-yong Lee

Yong-suk Choi

Sang-Dai Lee

Mi-Seong Kim

Se-Jong Yoo

Mi-Rae Lee

Young-Jun Jeon

Seong-Su Kim

Jong-Soon Yoo

Yong In Park

Hyun-Sik Seo

Seung-Han Paek

Seung Han Paek

Sung-Hwan Kim

Hyun-Cheol Shin

Sam-Young Cho

Choon Ho Park

Dae-Hyun Nam

Seong-Hee Nam

Kye-Chan Song

Jong-Il Kim

Suk-ll Yoon

Kui-Jong Baek

Tai-Hyung Rhee

Hyun-Jin An

Nam-Seo Kim

An inorganic light emitting diode device includes: a substrate including a plurality of sub-pixels; a thin film transistor (TFT) in each of the plurality of sub-pixels, wherein the TFT has at least one inorganic layer; an encapsulation layer on an organic light emitting layer, wherein the encapsulation layer includes at least one organic encapsulation layer and at least one inorganic encapsulation layer; and an opening exposing the inorganic layer of the TFT, wherein the opening connects the at least one inorganic encapsulation layer with the inorganic layer of the TFT.

Organic light emitting diode device

The present disclosure provides a touch display device including: a plurality of emitting elements; an adhesive layer over the emitting elements; a first touch electrode and a second touch electrode over the adhesive layer and in an active area; a pad electrode over the adhesive layer and in a touch pad region; and a protection layer over the first touch electrode, the second touch electrode and the pad electrode, wherein the first and second touch electrode are insulated by an insulating layer, and the protection layer includes at least one contact hole corresponding to the pad electrode, and wherein the pad electrode includes a plurality of electrode layers, and one of the plurality of electrode layers extends from the first touch electrode or the second touch electrode.

Touch display device and method of manufacturing of the same

An array substrate having double-layered metal patterns for use in a liquid crystal display device and a manufacturing method thereof are disclosed in the present invention. The array substrate includes a gate electrode and a gate line each having a molybdenum alloy (Mo-alloy) layer and a copper (Cu) layer configured sequentially on a substrate; a gate insulation layer on the substrate to cover the gate electrode and the gate line; an active layer arranged on the gate insulation layer in a portion over the gate electrode; an ohmic contact layer on the active layer; a data line on the gate insulation layer, the data line crossing the gate line and defining a pixel region; source and drain electrodes on the ohmic contact layer, the source electrode extending from the data line, and the drain electrode spaced apart from the source electrode; a passivation layer on the gate insulation layer covering the data line and the source and drain electrode, the passivation layer having a drain contact hole exposing a portion of the drain electrode; and a pixel electrode configured on the passivation layer in the pixel region, the pixel electrode electrically contacting the drain electrode through the drain contact hole.

Method of fabricating array substrate having double-layered patterns

Disclosed is a method of fabricating a display device that includes: forming an adhesive layer of an inorganic material on a carrier substrate having a display area and a non-display area surrounding the display area; forming a plurality of adhesive patterns of a metallic material on the adhesive layer, each of the plurality of adhesive patterns having a width and a height; forming a plastic substrate on the adhesive layer and the plurality of adhesive patterns; forming a plurality of elements for displaying images on the plastic substrate; cutting the carrier substrate and the plastic substrate to divide the display area and the non-display area; and detaching the carrier substrate from the plastic substrate.

Method of fabricating display device using plastic substrate

A manufacturing method of an electro line for a liquid crystal display device includes depositing a barrier layer made of a conducting material on a substrate, depositing a copper layer (Cu) on the barrier layer, wet-etching the Cu layer using a first etchant, and dry-etching the barrier layer using a second etchant using the wet-etched Cu layer as an etch mask.

Manufacturing method of electro line for liquid crystal display device

Disclosed is a display device including a thin film transistor. A method for forming the display device includes forming an organic semiconductor pattern in the presence of a magnetic field or an electric field. Due to the presence of a magnetic field or an electric field, the molecules of the organic semiconductor layer of the thin film transistor are substantially aligned in a predetermined direction.

Method of fabricating thin film transistor including organic semiconductor layer and substrate

A method of manufacturing a liquid crystal display device includes attaching a flexible substrate and a base substrate using an adhesive therebetween, the base substrate including substantially pure iron; forming a plurality of thin films on a surface of the flexible substrate attached to the base substrate, the surface of the flexible substrate opposite to the attached surface of the flexible substrate; and etching the base substrate after forming the plurality of thin films.

Liquid crystal display device and method of manufacturing the same

An etching solution for a multiple layer of copper and molybdenum includes: about 5% to about 30% by weight of a hydrogen peroxide; about 0.5% to about 5% by weight of an organic acid; about 0.2% to about 5% by weight of a phosphate; about 0.2% to about 5% by weight of a first additive having nitrogen; about 0.2% to about 5% by weight of a second additive having nitrogen; about 0.01% to about 1.0% by weight of a fluoric compound; and de-ionized water making a total amount of the etching solution 100% by weight.

Etching solution for multiple layer of copper and molybdenum and etching method using the same

A method of manufacturing an array substrate for a liquid crystal display device includes forming a gate electrode, a gate line, and a gate pad on a substrate, forming a gate insulating layer on the gate electrode, the gate line, and the gate pad, forming an active layer on the gate insulating layer, forming an ohmic contact layer on the active layer, forming source and drain electrodes, a data line and a data pad on the ohmic contact layer, forming a pixel electrode, forming a gate pad terminal on the gate insulating layer, forming a data pad terminal covering the data pad, forming a passivation layer on the pixel electrode, the gate pad terminal and the data pad terminal, exposing the gate pad terminal and the gate pad by etching the passivation layer and the gate insulating layer, and exposing the data pad terminal by etching the passivation layer.

Method of manufacturing array substrate for liquid crystal display device with gate pad terminal acting as etching mask

A composition for removing a conductive material and a manufacturing method of an array substrate using the composition, wherein the composition may include a nitric acid of about 3 to 15 wt %, a phosphoric acid of about 40 to 70 wt %, an acetic acid of about 5 to 35 wt %. The composition may further include a chlorine compound of about 0.05 to 5 wt %, a chlorine stabilizer of about 0.01 to 5 wt %, a pH stabilizer of about 0.01 to 5 wt %, and water of residual quantity.

Composition for removing conductive materials and manufacturing method of array substrate using the same

A composition for removing a copper-compatible resist includes: about 0.1% to about 10% by weight of an alkylbenzenesulfonic compound; about 10% to about 99% by weight of a glycolether compound; and about 0.5% to about 5% by weight of a corrosion inhibitor.

Composition and method for removing copper-compatible resist

A composition for removing a copper-compatible resist includes about 10% to about 30% by weight of an amine compound, about 10% to about 80% by weight of a glycolether compound, and about 10% to about 80% by weight of a polar solvent.

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Seoul, South Korea

Kyoung-Mook Lee