Samsung Electro-Mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Kyoung Moo Harr

Kyung Seob Oh

Hyoung Joon Kim

Ji Hoon Kim

Ji Hyun Lee

Doo Hwan Lee

Young Gwan Ko

Seung Yeop Kook

Seung Chul Oh

Yoon Suk Cho

Sung Woo Han

Sun Ho Kim

Kyung Suk Oh

Yoon Su Kim

Du Sung Jung

Kyung Suk Shim

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole, having an active surface having a connection pad disposed thereon and an inactive surface opposing the active surface, and having a protrusion bump disposed on the connection pad; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip. In the fan-out semiconductor package, step portions of the protrusion bumps may be removed.

Fan-out semiconductor package

A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, the semiconductor chip having an active surface with connection pads disposed thereon and the semiconductor chip having an inactive surface opposing the active surface, an encapsulant, and a second connection member disposed on the first connection member and the active surface of the semiconductor chip, wherein the first connection member and the second connection member include redistribution layers electrically connected to the connection pads, wherein the semiconductor chip includes a first passivation layer disposed on the active surface and the semiconductor chip includes a second passivation layer disposed on the first passivation layer, and wherein the redistribution layer of the second connection member is directly formed on one surface of the second passivation layer and extends onto one surface of the first connection member.

Fan-out semiconductor package and method of manufacturing the fan-out semiconductor

The present disclosure relates to a fan-out semiconductor package including a frame having a through hole, a semiconductor chip disposed in the through hole, a first encapsulant disposed in a space between the frame and the semiconductor chip, a second encapsulant disposed on one sides of the frame and the semiconductor chip, and a redistribution layer disposed on the other sides of the frame and the semiconductor chip, and a method of manufacturing the same. The first encapsulant and the second encapsulant may include different materials.

Fan-out semiconductor package and method of manufacturing same

A fan-out semiconductor package includes a frame having a through hole, a semiconductor chip disposed in the through hole and including connection pads, an encapsulant encapsulating at least a portion of the frame and the semiconductor chip, and a redistribution layer disposed on the frame and the semiconductor chip and including a first region and a second region. In the first region, a first via and a second via, electrically connected to one of the connection pads, disposed in different layers, and connected by a wiring pattern, are disposed. In the second region, a third via and a fourth via, electrically connected to another of the connection pads, disposed in different layers, and connected by the wiring pattern, are disposed. A distance between axes of the first via and the second via is shorter than a distance between axes of the third via and the fourth via.

A fan-out semiconductor package includes: a semiconductor chip; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on an active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip. The redistribution layer includes a line pattern having a first line portion having a first line width and a second line portion connected to the first line portion and having a second line width, greater than the first line width, a fan-in region is a projected surface of the semiconductor chip projected in a direction perpendicular to the active surface, a fan-out region is a region surrounding the fan-in region, and the second line portion at least passes through a boundary between the fan-in region and the fan-out region.

A fan-out semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip. The connection member includes a plurality of insulating layers, a plurality of redistribution layers disposed on the plurality of insulating layers, respectively, and a plurality of via layers penetrating through the plurality of insulating layers, respectively, and at least two of the plurality of insulating layers or at least two of the plurality of via layers have different thicknesses.

An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.

Electronic component package and method of manufacturing the same

Disclosed herein is a method for removing a seed layer in manufacturing a printed circuit board, the method including: forming a photo resist layer on a printed circuit board having a seed layer formed on a surface thereof; removing the photo resist layer according to a predetermined pattern; forming a plating layer for a circuit on the predetermined pattern from which the photo resist layer is removed; exposing the seed layer by removing the photo resist layer around the plating layer; forming a corrosion layer on surfaces of the seed layer and the plating layer by performing a chemical reaction of the substrate from which the seed layer is exposed in a reactor in which a predetermined gas is filled; and removing the seed layer by irradiating a laser on the corrosion layer to remove the corrosion layer.

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Suwon-si, South Korea

Kyoung Moo Harr