Samsung Electronics Co., Ltd.

Kyoung-Min Lee

Byeong-Soo Kim

Soo-Hyun Yoon

Yun-Hyeok Im

Dong-Ju Shin

Myung-Kyoon Yim

Kyung-Soo Lee

Wook Hwan Kim

Yunhyeok Im

Kyungsoo Lee

Byeong-soo Kim

Tae Woo Kang

Hee Seok Lee

Yun Hyeok Im

Horang Jang

Yeong Seok Kim

To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.

Method of dynamic thermal management of electronic device

The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.

Semiconductor package

A semiconductor package includes a bottom package having a lower substrate and a lower semiconductor chip mounted on the lower substrate, an interposer substrate on the bottom package, a first top package and a second top package that are mounted on the interposer substrate, and a heat spreader that is interposed between the first top package and the second top package and separates the first and second top packages from each other. The heat spreader is adhered to the interposer substrate through a plurality of first connection terminals.

A controller configured to: acquire a temperature of a first component and a temperature of a second component; and adjust a thermal resistance of a medium between the first component and the second component based on the acquired temperature of the first component, the acquired temperature of the second component, a first temperature limit of the first component, and a second temperature limit of the second component.

Controllers, apparatuses, and methods for thermal management using adaptive thermal resistance and thermal capacity

Washing machine

Intake for cleaner

Cleaner

Growing community of inventors

Goyang-si, South Korea

Kyoung-Min Lee