Cheil Industries Inc.

Samsung Sdi Co., Inc.

Kyoung Jin Ha

Ji Hye Kwon

Seung Jib Choi

Kil Sung Lee

Chang Min Lee

Seong Ryong Nam

Irina Nam

Yeon Soo Lee

Ji Yeon Lee

Lee June Kim

Sung Min Ko

Se Il Oh

Woo Jin Jeong

Chang Soo Woo

Eun Hwan Jeong

Han Sung Yu

Lee Jun Kim

Chul Ho Jeong

Ji Ho Kim

Mi Sun Kim

Jin Seong Park

Baek Soung Park

Chang Beom Chung

Su Mi Im

Ah Ram Pyun

Chang Bum Chung

Ki Sung Jung

Wan Jung Kim

Yong Woo Hong

Min Kyu Hwang

Jun Suk Kim

Min Haeng Cho

Hyo Young Kwon

Kyung Ju Lee

A photocurable composition includes (A) a photocurable monomer and (B) a silicon-containing monomer or oligomer thereof, the silicon-containing monomer being represented by Formula 1 

Apparatus comprising an encapsulated member

The present invention relates to: a photocurable composition containing (A) a photocurable monomer and (B) a monomer containing phosphorus and an amide group; and a device including a barrier layer formed of the composition.

Photocurable composition and device including barrier layer formed from composition

A composition for encapsulation of an organic light emitting diode and an organic light emitting diode display manufactured using the same. The composition for encapsulation includes: about 10 wt % to about 70 wt % of (A) a non-silicon-based di(meth)acrylate; about 20 wt % to about 70 wt % of (B) a silicon-based di(meth)acrylate; about 5 wt % to about 40 wt % of (C) a mono(meth)acrylate; and about 1 wt % to about 10 wt % of (D) an initiator, wherein the (B) silicon-based di(meth)acrylate is represented by Formula 1.

Organic light emitting device encapsulating composition, and organic light emitting device display apparatus manufactured using same

The present invention relates to a photocurable composition including (A) a photocurable monomer, (B) a monomer of chemical formula 1 or an oligomer thereof and (C) an initiator, a barrier layer including the same and an enveloped device including the same.

Photocurable composition and enveloped device including same

A composition for encapsulating an organic light emitting diode device and an organic light emitting diode display, the composition including a di(meth)acrylate including an unsubstituted alkylene group, a tri(meth)acrylate including a substituted or unsubstituted alkylene group or a substituted or unsubstituted alkyl group, and a photo-initiator, wherein the composition for encapsulating the organic light emitting diode device has a chloride content of about 200 ppm or less.

Composition for encapsulating organic light emitting diode device and organic light emitting diode display using the same

A composition for encapsulation and an encapsulated apparatus, the composition including a (meth)acrylic alkoxysilane monomer including a moiety represented by Formula 1 or 2, below, or an oligomer thereof; a multifunctional (meth)acrylate monomer or an oligomer thereof; and an initiator, wherein * and ** represent a binding site between elements.

Composition for encapsulation and encapsulated apparatus including the same

A composition for encapsulation of an organic light emitting diode comprising a photocurable monomer, a silicon-containing monomer, and an initiator, wherein the silicon-containing monomer is represented by Formula 1, and an organic light emitting diode display are disclosed.

Composition for encapsulation of organic light emitting diode and organic light emitting diode display manufactured using the same

The present invention relates to an encapsulating composition, a barrier layer including the same, and an encapsulated apparatus including the same, and the composition comprises (A) a photocurable monomer and (B) a photocurable monomer containing a carboxylic acid group, wherein (B) the photocurable monomer containing the carboxylic acid group has an amide bond.

Encapsulating composition, barrier layer including same, and encapsulated apparatus including same

Disclosed are a photocurable composition which includes (A) a photocurable monomer and (B) a monomer represented by Formula 1, and an apparatus including a protective layers formed of the composition; 

Photocurable composition, protective layer including the same, and encapsulated apparatus including the same

The present invention relates to a photocurable composition, to a barrier layer including same, and to an encapsulated device including same, wherein the composition comprises a photocurable monomer(A) and a silicon containing monomer(B), wherein the silicon containing monomers(B) has a structure according to Formula 1.

Photocurable composition, barrier layer including same, and encapsulated device including same

An adhesive composition includes an acrylic copolymer having at least one alkyl group, at least one hydroxyl group, and at least one furyl based group; and a curing agent.

Acrylic adhesive composition and polarizer film using the same

A photocurable composition, a composition for encapsulation of an organic light emitting diode, and an encapsulated apparatus, wherein, in the photocurable composition, when A represents a glass-metal alloy die shear strength in kgf between a glass substrate and a Ni/Fe alloy after curing, and B represents curing shrinkage in % as determined by Equation 1, below, and the photocurable composition has a value for A/B of about 0.7 kgf/% or more and the glass-metal alloy die shear strength of about 2.5 kgf or more,Curing shrinkage=|(Specific gravity of solid photocurable composition after curing)&#x2212;(Specific gravity of liquid photocurable composition before curing)|/(Specific gravity of liquid photocurable composition before curing)&#xd7;100.&#x2003;&#x2003;&#x3c;Equation 1&#x3e;

Photocurable composition and encapsulated apparatus prepared using the same

The present invention relates to a photocurable adhesive composition. The photocurable adhesive composition comprises a urethane(meth)acrylate resin, a functional-group-containing polybutadiene, a photocurable monomer and a photoinitiator; and the functional group is either an epoxy group or a hydroxyl group. The photocurable adhesive composition ensures good outdoor readability, has outstanding adhesive properties, and impact strength and optical transparency, and minimizes the phenomenon whereby substantial contraction occurs during photocuring, and thus can be suitably used for a display.

Photocurable adhesive composition and display device comprising same

An optically clear adhesive, a dicing die bonding film, and a semiconductor device, the optically clear adhesive including a curing agent; and an acrylic copolymer, the acrylic copolymer including an alkyl group, a hydroxyl group, and at least one of a phosphate group and a silane group.

Optically clear adhesive for dicing die bonding film

A liquid crystal display module includes a backlight unit, a liquid crystal display panel on a top surface of the backlight unit, and a thermoplastic layer on at least one lateral surface of the backlight unit and at least one lateral surface of the liquid crystal display panel, the thermoplastic layer including a solidified thermoplastic resin exhibiting viscosity of about 300 cps to about 1,000 cps at a temperature of about 120&#xb0; C. to about 130&#xb0; C.

Growing community of inventors

Uiwang-si, South Korea

Kyoung Jin Ha