Samsung Electronics Co., Ltd.

Kyoung-hwan Kim

In-Gi Kim

In-seak Hwang

Dae-Hyuk Chung

Byung-Lyul Park

Hyun-Chul Kim

Young-Hoo Kim

Yong-Jun Choi

Hyo-San Lee

Gyung-Jin Min

Tae-Hong Kim

Kun-sang Park

Eun-Seok Lee

Jin-Suk Hong

Myung-Woo Kim

Il-Sang Lee

Sang-won Bae

Tae-woo Kang

Bon-Ok Koo

Sung-Ki Roh

Young-gyu Ahn

Byung-Bok Kang

Seok-Min Kang

A chemical liquid supply apparatus includes a nozzle unit including a nozzle arm and an injection nozzle mounted in an end of the nozzle arm, a chemical liquid supply unit including a first chemical liquid tank accommodating a first chemical liquid and a second chemical liquid tank accommodating a second chemical liquid, and supplying the first chemical liquid and the second chemical liquid to the nozzle unit, and a mixer unit provided in the nozzle unit and discharging a process fluid by mixing the first chemical liquid and the second chemical liquid, wherein the mixer unit includes an in-line mixer mixing the first chemical liquid and the second chemical liquid that are continually injected from the chemical liquid supply unit, and a mixer pipe extending from the in-line mixer to the injection nozzle.

Chemical liquid supply apparatus and semiconductor processing apparatus having the same

A method of manufacturing a semiconductor package includes providing a substrate including a mounting region having a recess space for accommodating a semiconductor chip and a connection region surrounding the mounting region, providing a semiconductor chip in the mounting region, the semiconductor chip including a connection pad provided on a top surface of the semiconductor chip, forming a protective layer covering a top surface of the substrate and the top surface of the semiconductor chip, forming a photosensitive insulating layer on the protective layer after forming the protective layer, patterning the photosensitive insulating layer thereby exposing the protective layer, removing the exposed protective layer, and forming a redistribution line to be electrically connected to the connection pad.

Method of manufacturing semiconductor package

In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.

Method of inspecting a surface of a substrate and apparatus for performing the same

In an apparatus and method for removing a photoresist structure from a substrate, a chamber for receiving the substrate includes a showerhead for uniformly distributing a mixture of water vapor and ozone gas onto the substrate. The showerhead includes a first space having walls and configured to receive the water vapor, and a second space connected to the first space so that the water vapor is supplied to and partially condensed into liquid water on one or more walls of the first space. Ozone gas and water vapor without liquid water may be supplied to the second space to form the mixture therein. The showerhead may be heated to vaporize the liquid water on a given surface of the first space.

Apparatus and method for removing a photoresist structure from a substrate

An apparatus and method for removing horizontal moire of a cathode-ray tube (CRT) monitor system, wherein horizontal moire can be completely removed even when the moire that occurs in an upper portion of the monitor is different from the moire that occurs in a lower portion of the monitor. In one aspect of the invention, a method for removing horizontal moire in a cathode ray tube (CRT) monitor comprises generating moire correction data in synchronization with a vertical synchronous signal, the moire correction data comprising a sawtooth waveform, adjusting one of a direct current (DC) component, an alternating current (AC) component, and both the DC and AC component, of the moire correction data, outputting the adjusted moire correction data for every other horizontal scan line in synchronization with an odd-numbered or an even-numbered horizontal synchronous signal, and delaying a horizontal drive signal in response to the output adjusted moire correction data.

Apparatus and method for removing horizontal moire in cathode-ray tube monitors

A convergence correction circuit including a coordinate unit which sets a predetermined range with first level values according to a screen length; an interval unit which divides the screen length; an interval decoder which calculates the value of the branch point of each interval determined by the interval unit; an interval gain unit which stores the gain of each interval; a subtracter which subtracts the output of the coordinate unit from the output of the interval decoder; a multiplier which multiplies the output of the subtracter by the output of the interval gain unit; a level shifter which sets an initial and last value of each interval upon horizontal scanning; an adder which adds the output of the multiplier and the output of the level shifter; a digital-analog converter which converts the output of the adder; and a correction coil which corrects the convergence according to the converted output.

Digital realtime convergence correction circuit and method thereof

Growing community of inventors

Yongin-si, South Korea

Kyoung-hwan Kim