Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Kyouichirou Nakatsugi

Yasuhiro Okuda

Masamichi Yamamoto

Masahiro Adachi

Wataru Sakurai

Yoshio Oka

Noriki Hayashi

Kenji Miyazaki

Mitsuaki Tamura

Takashi Yamaguchi

Hideki Matsubara

Masahiko Kanda

Hideaki Toshioka

Ayao Kariya

Narito Yagi

Shigeki Kawakami

Michihiro Kimura

Katsuhiro Satou

By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrodeand a second connecting electrodeare connected together through a conductive adhesivethat is interposed between the electrodes, includes an organic film formation step in which an organic filmis formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device

There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.

Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same

The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boardsandelectrically connects a plurality of first electrodesandprovided to be adjacent to each other on a first boardwith a plurality of second electrodesandprovided to be adjacent to each other on a second boardthrough an adhesivethat contains conductive particlesand that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrodeand second electrodeand between the mutually facing first electrodeand second electrode, an adhesive layeris formed between the first boardand the second boardand in the adhesive layer, a cavity portionis formed between the first electrodesandand between the second electrodesand

Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity

There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrodeand a second connection electrodeare connected to each other with a conductive adhesive layertherebetween includes organic filmsandformed on at least the first connection electrode and conductive particlescontained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.

Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus

An object is to obtain a module in which an optical fiber can be inserted after a ferrule has been mounted on a circuit board. There is provided an optical module () in which at least a ferrule () and an electric component () are mounted on a circuit board () on which external electrodes () have been mounted; a fiber through-hole is formed in the ferrule () in a position in which the optoelectric conversion device () is mounted on one end surface and that corresponds to an active layer of an optoelectric conversion device (); and the optoelectric conversion device () of the ferrule () is electrically connected to the electric component (). In the ferrule (), an opening in the one end face of the fiber through-hole that faces the optoelectric conversion device () is blocked by a transparent substance (), and a portion that excludes the fiber through-hole at the other end surface is are monolithically covered with a molding resin ().

Optoelectric conversion module, method for assembling same, and optoelectric information processor using same

A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 &#x3bc;m or less and the maximum particle diameter of which is 15 &#x3bc;m or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

Method for producing printed wiring board

Growing community of inventors

Osaka, Japan

Kyouichirou Nakatsugi