Hitachi Maxell, Limited

Hitachi Maxwell, Ltd.

Kyouichi Kohama

Toshinobu Sueyoshi

Ryuzo Fukao

Kazuhiko Daido

Wasao Takasugi

Kaname Tamada

Yusuke Hirai

The present invention provides an information carrier which has flat surfaces, is excellent in beautiful appearance and permits beautiful necessary printing, and a production process which permits easy and inexpensive production of such an information carrier. An IC chipand a coilconnected to the IC chip are embedded in a substratecomposed of a nonwoven fabric. The IC chip and the coil are held between two nonwoven fabrics produced according to a conventional production procedure. The laminate of the nonwoven fabrics is fed to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their mating surfaces are joined with or without an adhesive (including low-melting synthetic resin fiber) incorporated into the webs. After positioning of the coil in the thus obtained raw product of information carrier, the laminate of the nonwoven fabrics and cover sheets is cut to obtain an information carrier of predetermined shape and size.

Information carrier and process for production thereof

The present invention provides an information carrier which has flat surfaces, is excellent in beautiful appearance and permits beautiful necessary printing, and a production process which permits easy and inexpensive production of such an information carrier. An IC chip and a coil connected to the IC chip are embedded in a substrate composed of a nonwoven fabric. The IC chip and the coil are held between two nonwoven fabrics produced according to a conventional production procedure. The laminate of the nonwoven fabrics is fed to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their mating surfaces are joined with or without an adhesive (including low-melting synthetic resin fiber) incorporated into the webs. After positioning of the coil in the thus obtained raw product of information carrier, the laminate of the nonwoven fabrics and cover sheets is cut to obtain an information carrier of predetermined shape and size.

There is a flexible IC module utilizable for the production of contactless IC cards and a method for producing an information carrier using the flexible IC module. An IC chip and a coil are embedded in a flexible substrate comprising a nonwoven fabric or the like having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property. This flexible IC module is produced in the following procedure. {circle around (1)} A first nonwoven fabric having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property is placed on a bottom force . {circle around (2)} An IC chip and a coil are placed on the first nonwoven fabric after positioning them. {circle around (3)} A second nonwoven fabric is superposed on the IC chip and coil. {circle around (4)} A top force is pressed onto the second nonwoven fabric, and the first and second nonwoven fabrics, the IC chip and the coil are integrated by hot pressing.

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Toride, Japan

Kyouichi Kohama