Nitto-Denko Corporation

Kyotaro Yamada

Hironobu Machinaga

Toshihiro Tsurusawa

Takeshi Tanaka

Takahiro Ikeda

Motoki Haishi

Eri Ueda

Yosuke Nakanishi

Hironori Kuwayama

A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.

Wiring circuit board and method of producing the wiring circuit board

A transparent conductive film () includes a polycrystal (). The polycrystal () has grains (). The grains () have an average value Df of a maximum Feret diameter of 160 to 400 nm.

Transparent conductive film, laminate, and method for producing transparent conductive film

A heater () includes a support () made of an organic polymer and having a sheet shape, a heating element (), and at least one pair of power supply electrodes () in contact with the heating element (). The heating element () is a transparent conductive film made of a polycrystalline material containing indium oxide as a main component. In the heater (), the heating element () has a specific resistance of 1.4&#xd7;10&#x3a9;&#xb7;cm to 3&#xd7;10&#x3a9;&#xb7;cm. The heating element () has a thickness of more than 20 nm and not more than 100 nm.

Heater

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Osaka, Japan

Kyotaro Yamada