Mitsubishi Denki Kabushiki Kaisha

Kyotaro Hirasawa

Kazunori Taguchi

Yuzuru Konishi

It is an object of the present invention to fix a semiconductor substrate and a thermal compensating plate in the alloy-free structure. An insulation resin (23) for side wall protection fixed on the outer periphery of a semiconductor substrate (1) and a projection (6a) inside an insulation tube are bonded with an adhesive agent (24) to restrict movements of the semiconductor substrate (1) in the radial direction. A thermal compensating plate (3) and a main electrode (5) are normally positioned with each other by a screw pin (32). A fixing ring (30) having resin or metal such as aluminum or the like which fits to the outer peripheral side of the main electrode (4) and the outer peripheral side of the thermal compensating plate (2) and the edge part of the upper main surface thereof restricts movement of the thermal compensating plate (2) in the radial direction. Further, a spring (31) interposed between a flange portion (4c) of the main electrode (4) and the fixing ring (30) presses and energizes the thermal compensating plates (2, 3) and the semiconductor substrate (1) against the main electrode (5). Since the free movements of the semiconductor substrate and the thermal compensating plates is restricted, the semiconductor substrate can be prevented from damage.

Semiconductor device

An object of the present invention is to enhance the transmission efficiency of light signals. An output end of a light guide is coupled to a light receiving portion of a semiconductor substrate with an optical coupling agent. Reflection preventing films of silicon dioxide are formed on both the output end and the input end of the light guide. Similar reflection preventing films are formed on both surfaces of a light introducing window provided at the input end of the light guide, too. The light introducing window is provided to maintain the inside of the device airtight while enabling passage of light signals. Since the reflection preventing films are formed, the transmission efficiency of light signals is high, so that the sensitivity of the device increases.

Growing community of inventors

Fukuoka, Japan

Kyotaro Hirasawa