Toyota Motor Engineering & Manufacturing North America, Inc.

Kyosuke N Miyagi

Ercan Mehmet Dede

Ercan Mehment Dede

Yuji Fukuoka

Shailesh N Joshi

Feng Zhou

Hiroshi Ukegawa

Hiroshi N Ukegawa

A method for predicting a failure of a power control unit of a vehicle is provided. The method includes obtaining data from a plurality of sensors of the power control unit of a vehicle subject to simulated multi-load conditions, implementing a machine learning algorithm on the data to obtain machine learning data, obtaining new data from the plurality of sensors of power control unit of the vehicle subject to real multi-load conditions, implementing the machine learning algorithm on the new data to obtain test data, predicting a failure of the power control unit based on a comparison between the test data and the machine learning data.

Methods and systems for predicting failure of a power control unit of a vehicle

A wireless in-wheel electric motor assembly having a wheel, an electric motor disposed within the wheel, the electric motor including a stator and a rotor, a receiving coil disposed within the wheel and operable to receive wirelessly transmitted energy, a first converter disposed within the wheel, electrically coupled to the receiving coil and operable to convert the wirelessly transmitted energy from the receiving coil into direct current, an inverter circuit disposed within the wheel, electrically coupled to the conversion circuit and the electric motor, and operable to power the electric motor. The wireless in-wheel electric motor assembly further includes a cooling system disposed within the wheel that includes a micro pump operable to pump coolant, a fluid line operable to pass the coolant proximate at least one of the conversion circuit and the inverter circuit, and a heat exchanger operable to receive heated coolant and dissipate heat to the environment.

Wireless in-wheel electric assemblies with integrated in-wheel cooling and vehicles incorporating the same

An electronics assembly includes a cooling chip structure having a device facing surface opposite a base surface and one or more sidewalls extending around a perimeter of the cooling chip structure between the device facing surface and the base surface. A plurality of fluid microchannels fluidly are coupled to a fluid inlet port and a fluid outlet port. A through substrate via extends from the base surface of the cooling chip structure to the device facing surface of the cooling chip structure, where the through substrate via intersects two or more fluid microchannels of the plurality of fluid microchannels.

Electronic assemblies having a cooling chip layer with fluid channels and through substrate vias

A power electronics assembly having a semiconductor device that includes a first device surface opposite a second device surface, a semiconductor substrate layer that extends from the first device surface to a substrate-drift interface, a semiconductor drift layer that extends from the substrate-drift interface towards the second device surface, and a semiconductor fluid channel is positioned within the semiconductor substrate layer of the semiconductor device. Further, the semiconductor fluid channel includes an inner surface. Moreover, a fluid channel metallization layer is positioned along the inner surface of the semiconductor fluid channel.

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Ann Arbor, MI, United States of America

Kyosuke N Miyagi