Panasonic Intellectual Property Management Co., Ltd.

Kyosuke Michigami

Tomohiro Fukao

Tomoaki Sawada

Takatoshi Abe

Daisuke Honda

Susumu Fukushima

Keiko Kashihara

Makoto Takashiro

Chihiro Horii

Qianying Li

Andy Behr

A method for manufacturing a stretchable circuit board includes preparing a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less, a second stretchable insulating layer, and a fluid; forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface; filling the fluid in the via; laminating the second stretchable insulating layer on the second surface to seal the via; and patterning the metal layer.

Method for manufacturing stretchable circuit board, metal-clad laminated sheet, metal foil with resin, stretchable circuit board, and stretchable circuit mounted article

An aspect of the present invention relates to a resin composition containing an acrylic resin and a curing agent, in which the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano group, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group, a weight average molecular weight of the acrylic resin is 50,000 or more and 3,000,000 or less, and a storage modulus of a cured product of the resin composition at 200° C. is 0.1 MPa or more and 3.5 MPa or less.

Resin composition, resin film using same, metal foil with resin, metal-clad laminate, and wiring board

A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.

Fiber sheet, and layered body, circuit board and electronic board using same

Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.

Stretchable circuit board

An aspect of the present invention relates to a conductive resin composition containing an epoxy resin, a curing agent, and a conductive powder, in which a loss modulus of a dried product or semi-cured product of the conductive resin composition at 170° C. is 0.1 MPa or more and 15 MPa or less.

Conductive resin composition, circuit board fabricated using conductive resin composition, and method of manufacturing circuit board

An elastic resin sheet that is a resin sheet formed using a resin composition containing a thermosetting resin and a curing agent, in which when a maximum height of a surface roughness on a first surface of the resin sheet is Rz1 (μm), a maximum height of a surface roughness on a second surface facing the first surface is Rz2 (μm), and a thickness is t (μm), the Rz1, the Rz2, and the thickness t (μm) satisfy relation of the following Formula (1): (Rz1+Rz2)/t≤0.5 (1), the elastic resin sheet includes a light-diffusing portion having irregularities with an arithmetic mean roughness Ra of 0.3 μm or more and 5.0 μm or less on at least one of the first surface and the second surface, and the elastic resin sheet has an initial tensile modulus of 0.5 MPa or more and 500 MPa or less.

Elastic resin sheet having light-diffusing portion, and light-emitting sheet using same preliminary class

A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.

Stretchable laminate, material for stretchable device, and stretchable device

One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

Growing community of inventors

Hyogo, Japan

Kyosuke Michigami