Dowa Electronics Materials Co., Ltd.

Kyoso Masuda

Masahiro Yoshida

Kenichi Inoue

Atsushi Ebara

Yoshiyuki Michiaki

Kozo Ogi

Yuki Kaneshiro

Shinichi Uchiyama

An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.

Silver-coated alloy powder, electrically conductive paste, electronic part, and electric device

An object of the present invention is to provide a phosphorus-containing copper powder with good volume resistivity and a small carbon content by suppressing an oxygen content to a relatively low value even if a particle size is made small, and a method for producing the same. In the phosphorus-containing copper powder containing phosphorus, a ratio of an oxygen content (wt. %) to a BET specific surface area (m/g) (oxygen content/BET specific surface area) is 0.90 wt. %&#xb7;g/mor less, a divalent copper compound is present on a surface of particles constituting the phosphorus-containing copper powder, a carbon content is 0.10 wt. % or less, and D50 is 7.11 &#x3bc;m or less.

Phosphorus-containing copper powder and method for producing the same

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Tokyo, Japan

Kyoso Masuda