Murata Manufacturing Co., Ltd.

Kyoshin Asakura

Yasunobu Yoneda

Tatsuo Haratani

Yasuyuki Naito

Masaaki Taniguchi

Yoichi Kuroda

Takanori Kondo

Haruo Hori

Shozo Takeuchi

Syozo Takeuchi

Ichiro Nozaki

A method for producing a ceramic electronic part includes forming a plurality of internal electrodes arranged in a ceramic sintered compact, superimposed via a ceramic layer. The free ends of the internal electrodes are formed to have a wedge-like cross-sectional shape, with the length L of the wedge and the internal thickness t of the electrode at the base of the wedge satisfying the relationship L>2t so that there is no risk of generating inter-layer peel-off or delamination in the ceramic layers.

Method for producing a ceramic electronic part

Multilayer capacitor, electronic device and high frequency circuit using the same

A ceramic electronic part includes a plurality of internal electrodes arranged in a ceramic sintered compact, superimposed via a ceramic layer. The free ends of the internal electrodes are formed to have a wedge-like cross-sectional shape, with the length L of the wedge and the internal thickness t of the electrode at the base of the wedge satisfying the relationship L>2t so that there is no risk of generating inter-layer peel-off or delamination in the ceramic layers.

Ceramic electronic part

A trimming capacitor with less drop in Q due to laser trimming, wherein a non-reducing ceramic material which can be sintered either within a neutral atmosphere or a reducing atmosphere is used as the material of the ceramic dielectric. A trimming capacitor electrode is provided on the surface of or within a ceramic dielectric containing internal capacitor electrodes. Part of the trimming capacitor electrode is removed by a laser beam to reduce an area thereof facing the internal capacitor electrode, to adjust the electrostatic capacitance to a desired value. The use of non-reducing ceramic material reduces the amount of dielectric material that is converted to semiconductor material during laser trimming.

Trimming capacitor having a void located within the dielectric

A trimming capacitor wherein its trimming direction has no directivity. The trimming capacitor comprises a dielectric ceramic sheet provided with a trimming capacitor electrode on the surface thereof, a dielectric ceramic sheet provided with internal capacitor electrodes on the surface thereof, and other sheets. Regions where the trimming capacitor electrode overlaps with the internal capacitor electrodes are disposed so as to be linearly symmetrical about a base line which is inclined by 45.degree. with respect to a long side of the trimming capacitor. Therefore, the trimming electrode can be trimmed in the same way in either the X or the Y direction of the trimming electrode.

Trimming capacitor

Multi-terminal, layered capacitors having excellent attenuation characteristics over a wide frequency range. A four-terminal, layered capacitor has a dielectric sheet with an internal inductor electrode connecting an external input terminal to an external output terminal, dielectric sheets with internal capacitor electrodes connected to the external input terminal, and internal capacitor electrodes connected to the external output terminal, and dielectric sheets with internal ground electrodes connected to external ground terminals. All these dielectric sheets are integrally stacked and calcined to form a one-piece structure.

Layered capacitors having an internal inductor element

A method of manufacturing laminated ceramic electronic components includes a step of forming a block by laminating ceramic green-sheets each having a main surface on which interior electrodes are formed with intervals in a direction orthogonally intersecting the main surfaces of the green-sheets. In a first cutting step, a first dicing blade having a width of 0.3 mm is pressed against the block at positions corresponding to the intervals between the electrodes to form grooves extending from one main surface toward the other main surface of the block, thereby to form a green mother board series in which a plurality of green mother boards being divided by the grooves are connected to each other via connection portions. Each of the green mother boards includes a plurality of element portions. Thereafter, the green mother board series is fired in a firing step. In a second cutting step, a second dicing blade having a width of 0.4 mm is pressed into the grooves of the mother board series after firing, to cut the connection portions. In this second cutting step, a side surface of each said mother board is ground by a side surface of the second dicing blade to expose outer edges of the interior electrodes. An exterior electrode is then applied to the outer edges.

Growing community of inventors

Sabae, Japan

Kyoshin Asakura