Samsung Electronics Co., Ltd.

Cheil Industries Inc.

Samyoung Pure Chemicals Co., Ltd.

Kyoochul Cho

Dong-Min Kang

Seunghyun Ahn

Baiksoon Choi

Myungkook Park

Dongchan Bae

Goun Kim

Taesung Kim

Sam-jong Choi

Yeonsook Kim

Jeong Ahn Kwon

Joonyoung Choi

Heesung Kim

Tae-Hyoung Koo

JungIg Jeon

Heon Jin Park

A titanium etchant composition and a method of forming a semiconductor device using the same, the titanium etchant composition including a titanium remover; a corrosion inhibitor; and a deionized water; wherein the corrosion inhibitor includes 5-aminotetrazole.

Titanium etchant composition and method of forming a semiconductor device using the same

Provided are a composition for removing a photoresist and a method of manufacturing a semiconductor device using the composition. The composition includes about 60-90 wt % of dimethyl sulfoxide, about 10-30 wt % of a polar organic solvent, about 0.5-1.5 wt % of hydroxy alkyl ammonium and about 1-10 wt % of an amine containing no hydroxyl group.

Composition for removing a photoresist and method of manufacturing semiconductor device using the composition

A method of processing a semiconductor wafer includes preheating the wafer to a preheating temperature that is less than a peak temperature, heating the wafer from the preheating temperature to the peak temperature at a first ramp rate that averages about 100&#xb0; C. per second or more, and, immediately after heating the wafer from the preheating temperature to the peak temperature, cooling the wafer at a second ramp rate that averages about &#x2212;70&#xb0; C. per second or more from the peak temperature to the preheating temperature, wherein the peak temperature is about 1,100&#xb0; C. or more.

Semiconductor wafer, semiconductor device using the same, and method and apparatus for producing the same

Growing community of inventors

Yongin-si, South Korea

Kyoochul Cho