Jusung Engineering Co., Ltd.

Ads Corporation

Kyoo Hwan Lee

Hyung Sup Lee

Young Ho Kwon

Chang Jae Lee

Jae Wook Choi

Duck Won Moon

Jae Hwan Jang

Deck Won Moon

Sung Tae Nam Goong

A substrate processing system and substrate transferring method is capable of improving substrate-transferring efficiency by transferring a substrate bi-directionally through a substrate transferring device between two rows of processing chambers, and transferring the substrate to a precise position by rotating the substrate transferring device. The processing system includes a transfer chamber, a bi-directional substrate transferring device; and processing chambers which apply a semiconductor-manufacturing process to the substrate. The processing chambers are linearly arranged along two confronting rows, and the transfer chamber is between the two rows of processing chambers. The substrate transferring device includes a moving unit inside the transfer chamber; a bi-directional substrate transferring unit in the moving unit, that transfers the substrate to the processing chamber through a bi-directional sliding movement; and a rotating unit between the moving unit and the bi-directional substrate transferring unit, that rotates the bi-directional substrate transferring unit at a predetermined angle.

Substrate processing system and substrate transferring method

A substrate processing system and substrate transferring method capable of transferring a substrate bi-directionally through the use of substrate transferring device provided between two rows of processing chambers arranged linearly, thereby improving the substrate-transferring efficiency, the substrate processing system includes a transfer chamber having at least one bi-directional substrate transferring device for bi-directionally transferring a substrate; and a plurality of processing chambers for applying a semiconductor-manufacturing process to the substrate, wherein the plurality of processing chambers are linearly arranged along two rows confronting each other, and the transfer chamber is interposed between the two rows of the processing chambers, wherein the bi-directional substrate transferring device have a moving unit inside the transfer chamber, and horizontally moved by a linear motor; and a bi-directional substrate transferring unit in the moving unit, the bi-directional substrate transferring unit transferring the substrate to the processing chamber through a bi-directional sliding movement.

Provided are a gas injector and a film deposition apparatus having the same. The gas injector includes a body, a supply hole, an injection hole, and a distribution plate. The body is configured to provide an inner space therein. The supply hole is formed in an upper surface of the body to communicate with the inner space and receive a raw material. The injection hole is formed in a lower surface of the body to communicate with the inner space and inject the raw material. The distribution plate is disposed in the inner space of the body. A through hole is formed in the distribution plate. The distribution plate is disposed to be inclined at a predetermined angle with respect to a horizontal plane. The gas injector can uniformly inject the raw material and improve vaporization efficiency of the raw material having a powder form.

Gas injector and film deposition apparatus having the same

The present invention provides an apparatus for supplying a source and an apparatus for depositing a thin film having the same. The apparatus for supplying a source includes a horizontal channel extending in one direction; pumping and transfer ports extending to pass through the horizontal channel, the pumping and transfer ports being spaced apart from each other; a transfer shaft inserted into the horizontal channel to reciprocate therein; and a storage room connected to one side of the pumping port, the storage room storing and supplying a powder source, wherein the transfer shaft comprises at least one transfer hole for allowing the powder source supplied through the pumping port to be filled therein and to be transferred to an external apparatus through the transfer port. As described above, according to the present invention, a powder source filled in a transfer hole is supplied to an external apparatus by reciprocating a transfer shaft, so that the amount of the powder source supplied to the external apparatus can be quantitatively controlled as much as a fixed quantity corresponding to the internal volume of the transfer hole.

Apparatus for supplying source and apparatus for deposition thin film having the same

Provided are a method for manufacturing a transparent electrode pattern and a method for manufacturing an electro-optic device having the transparent electrode pattern. The method for manufacturing the transparent electrode pattern includes forming a transparent electrode on a light-transmissive substrate, patterning the transparent electrode by removing a portion of the transparent electrode, and forming an insulating protective layer in an edge region of the patterned transparent electrode through a printing process. In accordance with the method, the insulating protective layer is formed in the edge region of the patterned transparent electrode through the printing process so that an apparatus and method for manufacturing the insulating protective layer can be simplified, resulting in a decrease in manufacturing cost.

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Gyeonggi-do, South Korea

Kyoo Hwan Lee