Samsung Display Co., Ltd.

Kyongho Hong

Jeongho Yi

Dokyun Kwon

Jinwon Baek

Jaebum Pahk

Seokjoo Lee

Jinpyung Lee

Jaeseok Park

Gyoowan Han

Cheollae Roh

Myungkyu Kim

Kyu-Bum Kim

Toshinaru Suzuki

Inho Lee

Sukbeom You

Sangsun Han

Jungseob Lee

Chang-kon Park

Dongjae Lee

Bosuck Jeon

Donghyeon Kim

Byunghun Sung

Jihun Kang

Jinwon Chang

A loading apparatus for a deposition mask includes a clamper that clamps the mask extending in a direction, a first adsorption part, a second adsorption part, and a connection part connected to the first adsorption part and the second adsorption part, and includes a picker that transfers the mask. In case that the picker transfers the mask, the first adsorption part adsorbs ends of the mask, the second adsorption unit adsorbs a portion between the ends of the mask, and the clamper clamps the mask between the first adsorption part and the second adsorption part.

Loading apparatus for deposition mask

A laser processing apparatus includes a stage configured to transfer a target substrate and including an opening, an electrostatic chuck disposed on the stage and including a plurality of holes, and a laser irradiation unit disposed above the stage and spaced apart from the stage and configured to irradiate a laser beam on the target substrate. A surface of the electrostatic chuck is in contact with the target substrate, the target substrate includes a plurality of etching regions to be etched by the laser beam and a non-etching region surrounding the plurality of etching regions of the target substrate, and the plurality of holes of the electrostatic chuck overlap the opening of the stage and the plurality of etching regions of the target substrate.

Laser processing apparatus

The apparatus for manufacturing a display apparatus includes: a carrier; a support arranged to be spaced apart from the carrier; a driver connected to the support to linearly move the support; and an elastic portion arranged between the driver and the support to provide an elastic force to the support, wherein the support includes: a first surface on which a substrate is to be mounted; and a second surface projecting upward from the first surface to selectively contact the carrier.

Method for manufacturing display apparatus while minimizing damage to the display apparatus

A laser processing apparatus includes: a laser light source configured to emit a laser beam; an optical scanner located along a path of the laser beam and configured to adjust the path of the laser beam; a lens unit located along the path of the laser beam, the lens unit being configured to condense the laser beam; a first adapter located between the lens unit and the optical scanner and coupled to the lens unit; and a second adapter located between the first adapter and the optical scanner, the second adapter being coupled to the first adapter and the optical scanner.

Laser processing apparatus and method of manufacturing the same

A laser apparatus including a stage. A target substrate is mounted on the stage. The laser apparatus further includes a coupling unit disposed below the stage and coupled with a conveying unit, the conveying unit conveying the stage. The laser apparatus additionally includes a discharge unit disposed at a predetermined position for laser machining, configured to communicate with the coupling unit when docked with the coupling unit, and configured to discharge foreign matter that is generated during laser machining.

Laser apparatus including fastening holes and inlet grooves

A stage for cutting a substrate includes: a body member; a plurality of first discharging members, each including a first suction portion in the body member and a first partition wall portion connected to the first suction portion and protruding from a top surface of the body member, each of the first discharging members defining a first space connected to an outside; a plurality of second discharging members, each including a second suction portion in the body member and a second partition wall portion connected to the second suction portion and protruding from the top surface of the body member, each of the second discharging members defining a second space connected to the outside; a plurality of connecting pipes each connected to the first partition wall portion and the second partition wall portion; and a plurality of supply pipes connected to the connecting pipes.

Stage for cutting substrate and substrate cutting device

A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.

Substrate processing apparatus and substrate processing method

A particle removal device includes: a stage on which a target substrate is disposed; an inner case defining a first discharge opening through which the stage is exposed to an internal space of the inner case; an outer case including: a side wall portion surrounding the inner case, a protrusion portion protruded from the side wall portion toward the inner case, and a second discharge opening in fluid connection with the first discharge opening; a suction pump connected to the second discharge opening; an air injector in fluid connection with the internal space; and an intake opening in fluid connection with the first and second discharge openings. A width of the intake opening as a distance between the distal end of the inner case and the distal end of the protrusion portion is smaller than a width of the first discharge opening.

Particle removal apparatus and laser cutting apparatus including the same

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Hwaseong-si, South Korea

Kyongho Hong