Samsung Electronics Co., Ltd.

Kyong-il Kim

Jae-sik Min

Yong-shik Park

Seo-hyun Cho

Byung-ha Park

Myong-jong Kwon

Keon Kuk

Sung-Joon Park

Young-ung Ha

Il-ju Mun

Myung-jong Kwon

Tae-Kyun Kim

Sung-joon Park

Myung-song Jung

Sang-wook Lee

Yeon-kyoung Jung

Ji-woon Yeom

Jun-hyub Park

Su-ho Shin

Hyung Ki Choi

Eun-bong Han

O-hyun Beak

Jin-woo Jung

SungJoon Park

Nam-kyun Kim

Kwang-Ryul Kim

Jun-woo Suh

Jao-Sik Min

Sang-cheol Ko

Kwang-Ryul 246-2004 Hwanggol-Maeul Kim

Yong-Shik Park

A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

Hollow shielding structure for different types of circuit elements and manufacturing method thereof

An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

EMI shielding structure and manufacturing method therefor

An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.

Electromagnetic interference shielding structure

Manufacturing method of a hollow shielding structure for circuit elements

Provided are an inkjet printhead and a method of manufacturing the same. The inkjet printhead includes: a substrate, on which a plurality of heaters for heating ink to generated ink bubbles are formed; a chamber layer including a plurality of ink chambers formed on the substrate; and a nozzle layer including a plurality of nozzles formed on the chamber layer. In addition, at least one of the chamber layer and the nozzle layer is formed of an imide silicone resin.

Inkjet printhead and method of manufacturing the same

A heater of a thermal inkjet printhead. The heater is formed of tantalum aluminum oxynitride (Ta&#x2014;Al&#x2014;ON), wherein the tantalum aluminum oxynitride is formed of about 30 to about 60 atomic % tantalum, about 10 to about 30 atomic % aluminum, about 5 to about 30 atomic % oxygen, and about 5 to about 30 atomic % nitrogen.

Heater of an inkjet printhead and method of manufacturing the heater

An inkjet printhead and a method of manufacturing the same. In the inkjet printhead, a substrate includes an ink chamber formed in a top surface to contain ink to be ejected, an ink feedhole formed in a bottom surface to supply the ink to the ink chamber, and a restrictor formed between the ink chamber and the ink feedhole to connect the ink chamber and the ink feedhole. A plurality of passivation layers are formed on the substrate. A heater and a conductor to apply a current to the heater are formed between the passivation layers. A heat transfer layer is formed on the passivation layers in a predetermined shape. An epoxy nozzle layer is formed to cover the passivation layers and the heat transfer layer. The epoxy nozzle layer is formed with a nozzle that is connected to the ink chamber.

Thermal inkjet printheads and an inkjet image forming apparatus including the thermal inkjet printheads. Each of the thermal inkjet printheads includes a heater that heats ink by directly contacting the ink and is formed of an alloy of Pt&#x2014;Ru or an alloy of Pt&#x2014;Ir&#x2014;X, where X is at least a material selected from the group consisting of Ta, W, Cr, Al, and O.

Inkjet printhead and image forming apparatus including the same

A method of fabricating an ink jet head and an ink jet head fabricated thereby. The method includes preparing a substrate having a flow path region, a flow path structure region to define the flow path region, and a pad region disposed at edge portions of the substrate. At least one pressure-generating element to eject ink is formed on the substrate of the flow path region. An inserting material layer is formed on an entire surface of the substrate having the at least one pressure-generating element. The inserting material layer is patterned to form an inserting layer on the flow path structure region. A mold layer is formed on the substrate having the inserting layer to cover the flow path region. Next, a nozzle material layer is formed on the entire surface of the substrate having the inserting layer and the mold layer. The nozzle material layer is patterned to form a nozzle layer covering the inserting layer and the mold layer and having at least one nozzle passing through the nozzle material layer on the mold layer to correspond to the at least one pressure-generating element.

Method of fabricating ink jet head and ink jet head fabricated thereby

An inkjet printhead includes a substrate having an ink chamber which is filled with ink to be ejected, a nozzle plate formed on the substrate in a position corresponding to the ink chamber, and a heat generating resistor installed in the ink chamber and formed of TiN, where x ranges from 0.2 to 0.5, to generate ink bubbles in the ink by generating heat.

Inkjet printhead with heat generating resistor

A filter plate usable with an ink jet head, an ink jet head with the filter plate, and a method of fabricating the filter plate are provided. The filter plate includes a filter substrate having a filter hole region. Filter holes having angled line shapes extend through the filter substrate of the filter hole region. Each of the filter holes may include an upper filter hole formed to have a first angle with respect to the filter substrate at an upper portion of the filter substrate, and a lower filter hole formed at a lower portion of the filter substrate to be connected to the upper filter hole and having a second angle with respect to the filter substrate different from the first angle.

Filter plate usable with an ink jet head, an ink jet head with the filter plate, and a method of fabricating the filter plate

A thermal inkjet printhead. The inkjet printhead includes a heater that heats an ink in an ink chamber to generate a bubble, conductors to supply an electric current to the heater, and a bubble separation wall protuberantly formed on the heater to protect the heater by inducing an extermination position of a bubble when the bubble generated by the heater shrinks and dissipates.

Thermal inkjet printhead apparatus to regulate pressure exerted by bubbles in an ink chamber and method thereof

A method of fabricating an ink jet head having a metal chamber layer includes preparing a substrate having pressure-generating elements to generate pressure to eject ink ejection. The metal chamber layer to define sidewalls of an ink flow path is then formed on the substrate. A sacrificial layer is formed to fill a region where the ink flow path is to be formed between the sidewalls defined by the metal chamber layer. A nozzle layer having nozzles corresponding to the pressure-generating elements is formed on the metal chamber layer and the sacrificial layer.

Ink jet head including a metal chamber layer and a method of fabricating the same

An ink-jet printhead and a manufacturing method thereof include a substrate on which an ink chamber having a predetermined volume is formed, a passage for supplying ink to the ink chamber which is formed on a bottom of the ink chamber, a nozzle plate which includes a nozzle corresponding to a center of the ink chamber and at least two insulating layers formed on the substrate, a bubble guide formed inside the nozzle plate and extending from the nozzle into the ink chamber, and a heater which surrounds the nozzle and is disposed between the two insulating layers. A hydrophobic coating layer is formed on a surface of a uppermost layer of the nozzle plate, and a droplet ejecting portion that has a diameter smaller than that of the nozzle of the nozzle plate and is disposed on the same axis as the nozzle, is formed in the hydrophobic coating layer. The nozzle plate is prevented from becoming wet due to ink, stability of an ink spray and a consecutive spray performance are improved, and thus a printing quality and a printing performance of the ink-jet printhead are generally improved.

Ink-jet printhead with droplet ejecting portion provided in a hydrophobic layer

An ink-jet printhead includes a substrate on which an ink chamber is formed, and a nozzle plate to cover the ink chamber, having a nozzle through which ink droplets are ejected from the ink chamber, and formed of a stack of a multi-layer insulating layer. The ink-jet printhead also includes a heater buried in the nozzle plate to surround the nozzle, an interconnection layer buried in the nozzle plate to electrically connect to the heater, and a coating layer formed of photoresist on the nozzle plate and having a through hole-type droplet guide connected to the nozzle of the nozzle plate. The droplet guide is formed through the coating layer, which has a sufficient thickness, and enables a meniscus of ink to be rapidly restored and stabilized, and ink droplets to be ejected at a high speed and high frequency. Also, the ink-jet printhead has improved resistance to abrasion and chemicals.

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Seoul, South Korea

Kyong-il Kim