Dow Toray Co., Ltd.

Kyoko Toyama

Hiroshi Fukui

Yoshito Ushio

Norihisa Kishimoto

Hiroshi Ueki

Ryota Dogen

Masayasu Akasaka

An organopolysiloxane is provided. The organopolysiloxane is represented by a general formula. In the general formula, Rare the same or different aliphatic unsaturated monovalent hydrocarbon groups having 2 to 12 carbon atoms, Rs are the same or different monovalent hydrocarbon groups having 1 to 12 carbon atoms and not having an aliphatic unsaturated bond, Rs are the same or different alkyl groups having 1 to 3 carbon atoms, 'n' is an integer of from 1 and 500, and “a” is 0 or 1. A thermally conductive silicone composition having the organopolysiloxane as a component is also provided. The organopolysiloxane can be used as a surface treatment agent for a thermally conductive filler. The organopolysiloxane provides for favorable handling/workability of compositions even if such compositions are highly loaded with a thermally conductive filler.

Organopolysiloxane, method of producing the same, and thermally conductive silicone composition

A curable organopolysiloxane composition is provided. The composition has relatively low viscosity before curing, can be easily processed into a film shape, and has excellent mechanical strength (e.g., tensile strength, tear strength, elongation, and the like) when, e.g., used as a dielectric layer in a transducer. Other applications are also provided. The composition comprises: (A1, A2) a combination of chain organopolysiloxanes having an alkenyl group only on an end of a molecular chain, and a degree of polymerization within a range of 50 to 550 and a range of 600 to 1000; (B) hydrophobically treated reinforcing silica; (C) a siloxane resin containing an alkenyl group; (D) an organohydrogenpolysiloxane; and (E) a catalyst. The mass ratio of components (A1)/(A2) is within a range of 0.45 to 1.30, and the sum of component (B) and component (C) is within a range of 10 to 25 mass % of the entire composition.

Curable organopolysiloxane composition, cured product thereof, and transducer and the like equipped with said cured product

Provided is a curable organopolysiloxane composition for forming a film, which has low viscosity before curing, has excellent mechanical strength and dielectric breakdown strength after curing, and can provide a uniform and thin organopolysiloxane cured film. The curable organopolysiloxane composition comprises: a curing reactive organopolysiloxane, a curing agent, (D1) reinforcing fine particles having a BET specific surface area exceeding 100 m/g, which have been surface treated with an organic silicon compound, and (D2) reinforcing fine particles having a BET specific surface area within a range of 10 to 100 m/g, which have been surface treated with an organic silicon compound. The mass ratio of components (D1) and (D2) is within a range of 50:50 to 99:1, and the sum of components (D1) and (D2) is within a range of 10 to 40 mass %. A method of manufacturing an organopolysiloxane cured film using the curable organopolysiloxane composition is also provided.

Curable organopolysiloxane composition for forming films, and method for producing organopolysiloxane cured film

A silicone elastomer cured product having radical reactivity obtained by curing a composition is disclosed. The composition comprises (A) a chain organopolysiloxane having a curing reactive group, and optionally (B) an organohydrogen polysiloxane, (C1) a curing agent, and (D) an organopolysiloxane resin. The surface of the cured product has radical reactivity with, for example, an adhesive, and is easily removable along with, for example, adhesive tape after use as a protective material. In general, the cured product has excellent heat resistance and flexibility and exhibits good adhesion and conformity to a substrate so as not to separate from a substrate even when the cured product is cut together with the substrate while remaining easily removable from the substrate when desired. A protective material for an electronic component made of the cured product is also disclosed.

Cured silicone elastomer having radical reactivity and use of same

A curable organopolysiloxane composition is provided. The composition can be easily processed into a film shape and has a high specific dielectric constant, high dielectric breakdown strength, and a low Young's modulus, allowing for a high energy density to be achieved, in addition to having excellent mechanical strength when used as a dielectric layer in a transducer. A fluoroalkyl group-containing curable organopolysiloxane composition, which can be cured by an addition reaction, comprises: an organopolysiloxane containing an alkenyl group and a fluoroalkyl group; an organohydrogen polysiloxane having SiH at both terminals of a molecular chain but not having a fluoroalkyl group; and a linear fluoroalkyl group-containing organohydrogen polysiloxane or a branched fluoroalkyl group-containing organohydrogen polysiloxane having T units.

Fluoroalkyl group-containing curable organopolysiloxane composition, cured product thereof, and transducer or the like provided with cured product

A curing reactive silicone gel is provided. The curing reactive silicone gel is obtained by primarily curing a composition containing the following components in a gel form and further having secondarily curing reactivity. (A) an organopolysiloxane having at least two curing reactive groups in one molecule; (B) optionally, an organohydrogenpolysiloxane; and (C) a curing agent.

Curing reactive silicone gel and use thereof

Provided is a laminate having a gel layer on a substrate able to protect the substrate during various types of processing used in industrial production steps prior to curing. The gel layer has excellent heat resistance, softness and flexibility, a low modulus of elasticity, low stress, excellent stress buffering properties, and electronic component retention properties. The gel layer has higher shape retention before curing but changing after curing into a hard layer having excellent release properties. The laminate is easily and readily releasable from the substrate even when the cured layer is localized. Applications thereof are also provided (such as an electronic component manufacturing method). The laminate comprises a laminated reaction-curable silicone gel and a sheet-like member laminated via an adhesive layer on top of the reaction-curable silicone gel.

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Ichihara, Japan

Kyoko Toyama