Kao Corporation

Senju Metal Industry Co., Ltd.

Kyoko Kuramoto

Masayoshi Nojiri

Masaki Fukuhara

Hiromi Saimiya

Hiroshi Taguchi

Takeshi Iizaki

Shinobu Nagase

Tomotake Kagaya

Yasuji Kawashima

Henri Hanzawa

Katsuhiro Shinohara

A solder removing mechanismis a solder removing mechanism for removing solder from conveyance clawsfor conveying a substrateto which the solder is supplied. The solder removing comprise an abutment bodythat can relatively pass through recessesof the conveyance clawsor below the conveyance claws

Soldering apparatus

A method for treating hair, in which using as a boundary a depth X % in a range of 5% to 80% from the surface of hair toward the center along the long diameter axis extending through the center of the cross-section of hair, hair is divided into an A layer (a portion of a continuous color from the surface of hair to the depth X %) and a B layer (a portion including the center and having a continuous color different from the A layer, in which the depth from the surface of hair exceeds X %) and at least one value of &#x394;E*, &#x394;h and &#x394;C* between the color of the A layer and the color of the B layer is adjusted to 3 or more to change the hue and the color tone of hair appearance depending on viewing angle of the hair. A method for dyeing hair, having Step (I) of dyeing hair with a two-part permanent hair dye agent, and Step (II) of dyeing hair with a hair dye agent comprising a dye selected from (A-1) to (A-8). 

Method for treating hair

A hair dye composition comprising the following components (A), (B) and (C) and having pH (25&#xb0; C.) of 7.5 or more and 12 or less: 

Hair dye composition

Growing community of inventors

Shinagawa-ku, Japan

Kyoko Kuramoto