Kabushiki Kaisha Toshiba

Tokyo Institute of Technology

Kyoko Honma

Kazuhito Higuchi

Masayuki Uchida

Yusaku Asano

Toshiya Nakayama

Yasunari Ukita

Kazuma Hiraguri

Mayumi Machino

Tso-Fu Mark Chang

Masato Sone

An electroplating method according to an embodiment is a electroplating method of generating a metal film on a cathode surface by setting a negative potential to a cathode of an anode and the cathode provided in a reaction bath, including mixing and accommodating a plating solution containing at least plated metal ions, an electrolyte, and a surface active agent and a supercritical fluid in the reaction bath and applying a current in a concentration of the supercritical fluid and a cathode current density in which a polarization resistance obtained from a cathode polarization curve while the plated metal ions are reduced is larger than before the supercritical fluid is mixed.

Electroplating method and electroplating device

Growing community of inventors

Kawasaki, Japan

Kyoko Honma