Hitachi, Ltd.

Kyoko Amemiya

Kazuo Suzuki

Eiji Matsuzaki

Hideaki Sasaki

Fusaji Shoji

Shinichi Kazui

Nobuyuki Ushifusa

Kuninori Imai

Takao Terabayashi

Seiichi Tsuchida

Kenichi Okada

Shiyuki Sakaue

Teruo Takai

In order to reduce the address voltage in a gas discharge type display pane, the address electrodes in the display panel are formed on the barrier ribs. Further, a fluorescent layer is coated on the wall surface of the barrier ribs thereby suppressing erroneous light emission or degradation of the fluorescent layer during address discharge.

Gas discharge display panel having address electrodes located on second

A multi-channel module with a plurality of chips is mounted on a multilayer circuit board and has a simple and highly reliable structure cooling system for cooling the heat generated by the chips consuming a large amount of electric power. The cooling system uses in the horizontal direction a coolant supply pipe having straight tube sections and flexible bellows sections alternately disposed in the axial direction of the pipe. The straight tube sections of the aforesaid coolant supply pipe are brought into contact with the upper faces of the chips by a spring force so as to cool continuously the plurality of chips with the coolant flowing in one coolant supply pipe thereby providing a simply structured cooling system for chips. Such a structured cooling system enables the collective assembly of cooling parts for a plurality of chips with only a small number of parts and produces highly reliable effects thereby being able to implement the miniaturization of a main frame computer.

Multi-chip-module

Growing community of inventors

Kouhoku, Japan

Kyoko Amemiya