Omron Corporation

Soken & Chemical & Engineering Co., Ltd.

Kyoji Kitamura

Tomoyuki Nishida

Masaki Nakamura

Koji Yamamoto

Seiji Nakajima

Koji Takami

Masashi Doi

Takekazu Komori

Toyohiro Imaizumi

Yosuke Tatsuno

Mitsuo Ito

Tsutomu Kume

Hitoshi Hayashi

Yasuhiro Hegi

Tomonari Imabayashi

Daisuke Sato

Yuki Hoga

Shinya Okada

Kouji Yamamoto

Ryo Toyota

Tomoyuki Maki

A method for curing an adhesive composition includes: arranging an adhesive composition that transmits laser light of a first wavelength in contact with a surface of a first adherend that contains, at least at its surface, a first light-to-heat conversion material that generates heat by absorbing laser light of the first wavelength; and curing the adhesive composition by irradiating the adhesive composition and the first adherend with laser light of the first wavelength. In a method for manufacturing a bonded structure, a first bonded structure is manufactured by bonding the adhesive composition to the first adherend by using the method for curing an adhesive composition.

Method for curing adhesive composition and method for manufacturing bonded structure

An electrical contact switch device includes: a fixed contact; a movable contact configured to come into contact with and move away from the fixed contact; a casing configured to house the movable contact and the fixed contact inside, and the casing includes at least one micro opening whose opening area is 80 &#x3bc;mor less on an outer surface facing an outside.

Electrical contact switch device

An oil resistance test method for an electronic device is provided. At least one type of resin material is provided on at least a portion of an outer surface of the electronic device. The oil resistance test method includes: setting a test temperature; and immersing the electronic device in a water-soluble cutting oil in an atmosphere of the set test temperature. This cutting oil contains a mineral oil and a surfactant, and exhibits a milky-white appearance when diluted with water. The oil resistance test method further includes: determining, based on an electrical characteristic of the electronic device, whether or not the electronic device has been degraded by the cutting oil; and estimating, based on a total immersion time of the electronic device in the cutting oil until degradation of the electronic device is detected, a life of oil resistance of the electronic device.

Oil resistance test method and oil resistance test apparatus

A metal insert-molded article having sealing ability, a method for producing the same, and an electronic component having the metal insert-molded article, the metal insert-molded article comprising: a molding material and a metal material integrally molded together by insert molding, wherein the molding material comprises a crystalline thermoplastic resin as a main component, and comprises an inorganic filler in an amount inclusive of 0% by weight to 15% by weight, and the metal material has an aspect ratio inclusive of 1 to 10 in a cross section perpendicular to a lengthwise dimension of the metal insert-molded article, and is not surface treated for adhesion with the molding material.

Metal insert-molded article, a method for producing the same, and an electronic component

A resin according to the present invention includes an ester bond as an essential component and comprises an amine thin membrane on a surface of the resin. This makes it possible to provide (i) a resin having an amine membrane on its surface, (ii) a production method thereof, and (iii) use thereof.

Light guide including surface-treated resin

A light diffusing resin film is formed by curing a light-curable liquid resin composition whose indispensable components are a photo-polymerizable monomer (A), an organic compound (B) that is incompatible with the photo-polymerizable monomer (A), a cosolvent (C) that is compatible commonly with the photo-polymerizable monomer (A) and the organic compound (B) that is incompatible with the photo-polymerizable monomer (A), and a photo-polymerization initiator (D), a light diffusing film having the resin film on a film substrate, an edge lighting type backlight unit in which the light diffusing film is used, and a liquid crystal display device provided with the edge lighting type backlight unit.

Light diffusing films

The present invention is to provide a curable resin composition that is desirably used for manufacturing an optical part, in particular, an optical waveguide, that is superior in heat-resistant properties such as a heat-resistant decomposing property and a coloring-resistant property, and has its refractive index precisely controlled. The present invention provides a curable resin composition, comprising: The present also provides an optical part, in particular, an optical waveguide, formed by photo-and/or thermo-curing the above curable resin composition.

Curable resin composition, optical component and optical waveguide

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Uji, Japan

Kyoji Kitamura