Denso Corporation

Kyohei Koutake

Sumitomo Inomata

Masatake Nagaya

Hiromichi Morita

Tetsuji Yamaguchi

Fumiyoshi Kano

In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.

Growing community of inventors

Kariya, Japan

Kyohei Koutake