Seiko Epson Corporation

Kyo Horie

Kazuhiko Shimodaira

Shogo Inaba

A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.

Piezoelectric device and electronic apparatus

An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface.

Electronic device, electronic apparatus, and moving object

A sensor includes a flexible wafer substrate and an oscillator provided on a principal surface of the wafer substrate, and the oscillator deforms when an external force is applied to the wafer substrate.

Growing community of inventors

Okaya, Japan

Kyo Horie