Semes Co., Ltd.

Kyo Bong Kim

Sang-Oh Kim

Wan Hee Jeong

Hee Jae Byun

Ki Won Han

Doo Hyun Baek

Dong Chan Lee

Chan Young Choi

Hee Chan Kim

Embodiments of the inventive concept provide a wireless power apparatus for a substrate treating apparatus and a manufacturing method for the wireless power apparatus for the substrate treating apparatus for preventing a heat generation by preventing a generation of an eddy current in a coupling element, if the coupling element is used around an outer housing at which an induced magnetic field is formed. The inventive concept provides a wireless power apparatus for a substrate treating apparatus. The wireless power apparatus includes an outer housing having a main power line forming an induced magnetic field by receiving a power, and a coupling part coupling at least two components among components which are positioned at a periphery of the main power line for fixing the main power line; and an inner housing positioned spaced apart from the outer housing, generating an electromotive force through the induced magnetic field generated from the outer housing, and supplying the electromotive force which is generated to the substrate treating apparatus, and wherein the coupling part is formed of a material at which an eddy current is not generated by the induced magnetic field.

Wireless power apparatus for substrates treating apparatus and manufacturing method of wireless power apparatus for substrate treating apparatus

An electrostatic chuck includes a chuck body which supports a substrate, at least one pin hole penetrating the chuck body in a vertical direction, a lift pin disposed in one of the at least one pin hole, wherein the lift pin moves along the one of the at least one pin hole, and an expansion member which is provided at an inner circumference of the one of the at least one pin hole, the expansion member having an inner circumferential surface that, in response to a first power, selectively holds or releases an outer circumferential surface of the lift pin.

Substrate processing apparatus including electrostatic chuck, substrate processing method, and method of manufacturing electrostatic chuck

Growing community of inventors

Suwon-si, South Korea

Kyo Bong Kim