Seagate Technology Incorporated

Kyle M Bartholomew

Zine-Eddine Boutaghou

Wayne Allen Bonin

Roger Lee Hipwell, Jr

John Robert Pendray

Lance Eugene Stover

Roger L Hipwell

Jeremy Adam Thurn

John J Pendray

The application discloses processes for fabricating a slider or head for a data storage device. The processes disclosed provide a transducer portion that is separated from a slider body by a gap. In an illustrated embodiment, actuator elements are fabricated in the gap to adjust a position of the transducer portion relative to the slider body.

Process for fabricating a slider or head for a data storage device

A transducer-level microactuator selectively positions a transducer portion of a slider radially with respect to circumferential data tracks of a rotatable disc. The slider includes a slider body having a leading edge and a trailing edge, a transducer body and a flexure body. The transducer body is spaced from the trailing edge of the sliding body and includes at least one transducer element. The flexure body extends from the trailing edge of the slider body and includes a first anchor point connected to the slider body and a second anchor point connected to the transducer body. The basecoat layer is deposited on the trailing edge of the slider body and substantially surrounds the flexure body wherein a gap separates the flexure body from the basecoat. A first actuation assembly is formed on the basecoat and a second actuation assembly is formed on the transducer body adjacent the slider body.

Transducer-level microactuator for a magnetic recording system

A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the substrate and filled with a bond pad material to form slider bond pads. Excess bond pad material is removed from the trenches such that the slider bond pads are flush with the top surface of the substrate. A transducer is fabricated on the top surface of the substrate. Finally, the slider bond pads are exposed.

Wafer-level fabrication method for top or side slider bond pads

A head having micro-positioning control. The head includes a slider body and a transducer body coupled to the slider body through a flexible interface. The transducer body is spaced from the slider body to form a gap therebetween. Micro-positioning actuators are coupled to the transducer body in the gap to provide micro-positioning control. In an embodiment for an air bearing slider, the gap includes off-track and fly height positioning control.

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St. Louis Park, MN, United States of America

Kyle M Bartholomew