Intel Corporation

Kyle Kippes

Kris Frutschy

Kevin B George

Timothy F Bopp

Bruno Clark

An apparatus is described for a bridge clip used to hold an IC package to a process carrier in the semiconductor manufacturing processes. According to embodiments of the present invention, the bridge clip includes a bridge comprising a rectangular sheet having tabs at opposite ends the tabs having an irregular shape, a stiffener affixed to the bridge, the stiffener comprising a rectangular sheet sized to fit within the bent down tabs of the bridge and having a stiffening structure along a longitudinal axis of the stiffener, and a pressure plate coupled to the stiffener under the bridge and fitting within the tabs and long edges of the stiffener.

Bridge clip with reinforced stiffener

A bridge clip with a leaf holds an integrated heat spreader on a die during curing. The leaf may have at least two metal portions with different coefficients of thermal expansion (CTE) to exert a changing force on the heat spreader over temperature. The die may be coupled to the heat spreader with a polymer interface material which is cured at an elevated temperature. In embodiments in which the die is located off-center under the heat spreader, the clip may exert an off-center force on the heat spreader when curing at the elevated temperature due to the differing CTEs. In other embodiments, in which the die is located toward the center of the heat spreader, a leaf with two layers having different CTEs may help reduce variable contact geometry, which may be especially helpful in higher force situations.

Bridge clip with bimetallic leaf and method

A clip which can be used to retain a component assembly in a carrier during pick-and-place and thermal assembly operations is provided. The clip comprises an elongate bridgepiece having opposed ends; a pair of legs, each depending from one of the opposed ends of the bridgepiece, the legs being shaped in dimensions to mate with complementary apertures in the carrier to releasably lock the bridgepiece to the carrier at a fixed height therefrom; and a plurality of deformable formations on an underside of the bridgepiece in between the legs, the deformable formations being shaped, dimensioned, and positioned to deform when brought to bear against a component in the carrier in a manner that regularly inward forces are applied to the component along at least two intersecting axes, the forces being symmetrically distributed with respect to the component.

Growing community of inventors

Chandler, AZ, United States of America

Kyle Kippes