International Business Machines Corporation

Kyle Indukummar Giesen

Matteo Cocchini

Zachary Thomas Dreiss

Sarah K Czaplewski-Campbell

David S Wolpert

Roger Scott Krabbenhoft

Sylvain Pharand

Kyle Wonderly

Egduard Ramon Jauregui

Patrick James McKeone

Juan Martinez-Mantilla

Samuel Sagan

A circuit board includes a ground layer, a core layer positioned on the ground layer, an insulating layer positioned on the core layer, and a trace positioned between the core layer and the insulating layer. The circuit board also includes another ground layer positioned on the insulating layer, and an electromagnetic shield (EMS) extending between and electrically connected to the ground layers alongside the trace to shield the trace from electromagnetic radiation. The EMS extends along at least 90% of a length of the trace.

Circuit board local electromagnetic shielding

An electronic printed circuit board structure for mitigating conductive anodic filament growth. The structure includes at least two conductive layers and a dielectric layer sandwiched between the conductive layers. At least one hole extends through the dielectric layer, and a layer of nonconductive material covers the at least one hole, wherein the nonconductive material is glass-free. A conductive plate layer is disposed over the nonconductive material layer to form a via connection in the structure.

Method to manufacture conductive anodic filament-resistant microvias

A method may include forming a plurality of multilayer cores wherein each multilayer core comprises a sheet of cured dielectric material having a layer of metal on each side of the sheet of cured dielectric material, patterning each layer of metal in the plurality of multilayer cores to form wiring traces in each layer of metal, embedding a solder element in at least one sheet of a plurality of sheets of uncured dielectric material, wherein the solder element having a melting point temperature within a temperature range of a curing temperature of the uncured dielectric material, forming a printed circuit board by alternately stacking the plurality of multilayer cores with the plurality of sheets of uncured dielectric material between each multilayer core, laminating the stack of multilayer cores and sheets of uncured dielectric material to cause curing of the sheets of uncured dielectric material and melting of the solder element.

Buried via in a circuit board

An apparatus for detecting an obstruction in a conduit structure, the apparatus includes a sleeve portion, a plurality of sensor cells, a primary termination cap, and a secondary termination cap. The plurality of sensor cells coupled to the sleeve portion, wherein each sensor cell from the plurality of sensor cells is electrically coupled to the primary termination cap and the secondary termination cap. The sleeve portion configured to wrap around a conduit structure, wherein each sensor cell from the plurality of sensor cells is directed to an exterior surface of the conduit structure. The primary termination cap electrically and mechanically coupled to a first end of the sleeve portion, wherein the primary termination cap includes Wi-Fi transmitter, a primary microcontroller, and a power source connection. The secondary termination cap electrically and mechanically coupled to a second end of the sleeve portion to short the plurality of sensor cells.

Obstruction detecting sleeve for conduit structures

An example operation may include one or more of generating a noise map which comprises one or more noise shapes for one or more electrical components on a substrate of a circuit, modifying a design of the one or more electrical components in a pre-production design of the circuit based on the noise map and one or more noise rules of the circuit, and outputting an updated design of the circuit which includes the modified design of the one or more electrical components.

Noise-based optimization for integrated circuit design

Method of constructing a printed circuit board, preferably with one lamination step: constructing multilayer cores wherein each multilayer core includes a sheet of cured dielectric material having a layer of metal on each side of the sheet of cured dielectric material; patterning each layer of metal to form wiring traces; forming a sheet of uncured dielectric material; embedding a solder element in the sheet of the uncured dielectric material; alternately stacking the multilayer cores with the sheets of uncured dielectric material, the sheet of the uncured dielectric material having the embedded solder element positioned so as to be aligned with wiring traces in adjacent layers of metal in adjacent multilayer cores; heating the solder element so as to cause the solder element to melt; and hot pressing the stack of multilayer cores and sheets of uncured dielectric material to cause curing of the sheets of uncured dielectric material.

Growing community of inventors

Lagrangeville, NY, United States of America

Kyle Indukummar Giesen