Asm IP Holding B.v.

Asm America, Inc.

Asm IP Holdings B.v.

Kyle Fondurulia

Carl Louis White

Eric James Shero

Mohith E Verghese

Todd Robert Dunn

Herbert Terhorst

Timothy James Sullivan

John Kevin Shugrue

Mike Halpin

Marko Peussa

Sokol Ibrani

Darko Babic

Min Yan

Fred Pettinger

Dave Marquardt

Michael W Halpin

Jereld Lee Winkler

Lucian C Jdira

David Marquardt

Ankit Kimtee

Dinkar Nandwana

Michael Schmotzer

William George Petro

Mark Olstad

Christopher Wuester

Jianqiu Huang

Gejian Zhao

Melvin Verbass

Gnyanesh Trivedi

The present disclosure pertains to embodiments of a showerhead assembly which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber size and decreases cycling time. Decreased cycling time can improve throughput and decrease costs.

Showerhead assembly and components

A cooling apparatus and methods for maintaining a precursor source vessel heater at a desired temperature are disclosed. The apparatus and methods can be used to maintain a desired temperature gradient within the precursor source vessel for improved integrity of the precursor source before delivery of the precursor to a reaction chamber. The apparatus and methods can also be used for rapid cooling of a source vessel for maintenance.

Heater assembly including cooling apparatus and method of using same

A temperature control system for a chemical delivery system (e.g., comprised in a reactor system) may comprise a temperature control shell coupled to and/or enclosing at least a portion of at least one component of the chemical delivery system. A chemical delivery system may comprise a filter, an accumulator, and/or a chemical application line fluidly coupled to one another in any suitable arrangement and/or configuration. A temperature control system for such a chemical delivery system may comprise a filter temperature control shell coupled to and/or enclosing at least a portion of the filter, an accumulator temperature control shell coupled to and/or enclosing at least a portion of the accumulator, and/or an application line temperature control shell coupled to and/or enclosing at least a portion of the chemical application line.

Temperature-controlled chemical delivery system and reactor system including same

Gas supply assemblies and reactors systems including the gas supply assemblies are disclosed. An exemplary gas supply assembly includes a vessel, a valve plate, a housing encasing the vessel and the valve plate, a gas feedthrough having a first end interior of the housing and a second end exterior of the housing, and one or more valves attached to the valve plate, wherein at least one valve is fluidly coupled to an interior of the vessel. The assemblies can further include a removable gas line having a first end coupled to the at least one valve and a second end coupled to the gas feedthrough. Additionally or alternatively, a gas supply assembly can include one or more valve plate leveling devices coupled to the valve plate.

Gas supply assembly, components thereof, and reactor system including same

Herein disclosed are systems and methods related to solid source chemical vaporizer vessels and multiple chamber deposition modules. In some embodiments, a solid source chemical vaporizer includes a housing base and a housing lid. Some embodiments also include a first and second tray configured to be housed within the housing base, wherein each tray defines a first serpentine path adapted to hold solid source chemical and allow gas flow thereover. In some embodiments, a multiple chamber deposition module includes first and second vapor phase reaction chambers and a solid source chemical vaporizer vessel to supply each of the first and second vapor phase reaction chambers.

Reactant vaporizer and related systems and methods

Herein disclosed are systems and methods related to solid source chemical sublimator vessels and corresponding deposition modules. The solid source chemical sublimator can include a housing configured to hold solid chemical reactant therein. A lid may be disposed on a proximal portion of the housing. The lid can include a fluid inlet and a fluid outlet and define a serpentine flow path within a distal portion of the lid. The lid can be adapted to allow gas flow within the flow path. The solid source chemical sublimator can include a filter that is disposed between the serpentine flow path and the distal portion of the housing. The filter can have a porosity configured to restrict a passage of a solid chemical reactant therethrough.

Solid source sublimator

The present disclosure relates to a semiconductor processing apparatus having a reaction chamber which can include a baseplate having an opening; a moveable substrate support configured to support a substrate; a movement element configured to move a substrate held on the substrate support towards the opening of the baseplate; a plurality of gas inlets positioned above and configured to direct gas downwardly towards the substrate support; and a sealing element configured to form a seal between the baseplate and the substrate support, the seal positioned at a greater radial distance from a center of the substrate support than an outer edge of the substrate support. In some embodiments, the sealing element can also include a plurality of apertures extend through the sealing element, the apertures configured to provide a flow path between a position below the sealing element to a position above the sealing element.

Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination

Systems and methods related to temperature zone control systems can include a reactant source cabinet that is configured to be at least partially evacuated, a vessel base that is configured to hold solid source chemical reactant therein, and a lid that is coupled to a distal portion of the vessel base. The lid may include one or more lid valves. The system may further include a plurality of gas panel valves that are configured to deliver gas from a gas source to the vessel. The system may include a heating element that is configured to heat the one or more lid valves. The system may include a heat shield, a first portion of which is disposed between the one or more lid valves and the vessel base. A second portion of the heat shield may be disposed between the first heating element and the plurality of gas panel valves.

Heating zone separation for reactant evaporation system

A showerhead including a body having an opening, a first plate positioned within the opening and having a plurality of slots, a second plate positioned within the opening and having a plurality of slots, and wherein each of the first plate plurality of slots are concentrically aligned with the second plate plurality of slots.

Semiconductor reaction chamber showerhead

The present disclosure relates to a semiconductor processing apparatus having a reaction chamber which can include a baseplate having an opening; a moveable substrate support configured to support a substrate; a movement element configured to move a substrate held on the substrate support towards the opening of the baseplate; a plurality of gas inlets positioned above and configured to direct gas downwardly towards the substrate support; and a sealing element configured to form a seal between the baseplate and the substrate support, the seal positioned at a greater radial distance from a center of the substrate support than an outer edge of the substrate support. In some embodiments, the sealing element can also include a plurality of apertures extend through the sealing element, the apertures configured to provide a flow path between a position below the sealing element to a position above the sealing element. Some embodiments include two or more stacked sealing elements.

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange structures separated from one another by intervening gaps. The example gas channel plate also includes a heat exchange fluid director plate support surface for supporting a heat exchange fluid director plate above the plurality of heat exchange structures so that at least a portion of the plurality of heat exchange structures are spaced from the heat exchange fluid director plate.

Growing community of inventors

Phoenix, AZ, United States of America

Kyle Fondurulia