Osram Opto Semiconductors Gmbh

E.i. Dupont De Nemours and Company

Osram Semiconductors Gmbh

Kyle D Frischknecht

Karl Pichler

Matthew Stainer

Charles D Lang

Nigel Morton Coe

Raymond S Pflanzer

A light-emitting device is described with a flat light-emitting element on a substrate and is encapsulated under a cover. The cover is supported by at least one support element in a central section at a distance from the edge of the light-emitting element. Further provided are indentations in the surface facing the light-emitting element, in which is a cavity containing a getter material. At the boundary, the cover is sealed to the substrate with a sealing compound.

Light-emitting device with supported cover

There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.

Process for forming encapsulated electronic devices

In an embodiment of this invention, an adhesion layer is deposited on an encapsulation lid to provide strong adhesion with the UV-curable adhesive in order to improve encapsulation of an organic electronic device. The adhesion layer is comprised of a metallic layer or a ceramic layer that is thin enough to be nonopaque and thick enough to provide stronger adhesion at an interface with said UV-curable adhesive than said encapsulation lid.

Interface for UV-curable adhesives

In one embodiment of the invention, a first absorbing layer is on a substrate and/or a second absorbing layer is on a heat-activated adhesive. If the IR source that supplies IR radiation is present on the substrate-side, then the absorption percentage of the substrate is less than the absorption percentage of the first absorbing layer if present and less than the absorption percentage of the second absorbing layer if present. If the IR source that supplies IR radiation is present on the 'encapsulation cover'-side, then the absorption percentage of the encapsulation cover is less than the absorption percentage of the first absorbing layer if present and less than an absorption percentage of the second absorbing layer if present. The substrate and the encapsulation cover have a low thermal conductivity.

Sealing of electronic device using absorbing layer for glue line

An embodiment of an encapsulated organic optoelectronic device is described. The encapsulated device includes an organic optoelectronic device on a substrate and that organic optoelectronic device has a cathode. The encapsulated device further includes a diffusion layer that is on the organic optoelectronic device and that diffusion layer covers exposed areas of the organic optoelectronic device. An adhesive layer is on the substrate and is around a perimeter of the diffusion layer. An encapsulation lid is on the adhesive layer, and a getter is on the encapsulation lid such that the getter overlies the organic optoelectronic device. The diffusion layer slows a rate of absorption of reactive gasses by the cathode and increases a proportion of the reactive gasses absorbed by the getter relative to the cathode.

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Livermore, CA, United States of America

Kyle D Frischknecht