Texas Instruments Corporation

Kyle Brent Norell

Charles Allen DeVries

Claude Albert Fernandez

Kristen Nguyen Parrish

A device includes a circuit assembly and a first conductive winding support having a first end attached to the circuit assembly and having a first winding support surface a first distance from the circuit assembly. The device also includes a second conductive winding support having a second end attached to the circuit assembly and having a second winding support surface a second distance from the circuit assembly, the second distance being different than the first distance. A conductive winding has first and second winding ends. The first winding end is attached to the first winding support surface, and the second winding end is attached to the second winding support surface.

Leadframe for conductive winding

An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.

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Plano, TX, United States of America

Kyle Brent Norell