Samsung Electro-mechanics Co., Ltd.

Mirae Corporation

Kyeong Jun Kim

Ho In Jun

Sun Cheol Lee

Jin Sung Chun

Jang Hyun Lee

Hae Suk Chung

Seul Gi Kim

Woo Chul Shin

Sung Hoon Kim

Yoo Chang Kim

Byung Sung Kang

Seung Yul Lee

Jung Woo Kim

Jae Hyun Baik

Jung Seok Lee

Ta Kyoung Lee

Hang Kyu Cho

Ah Hyeon Im

Min Hyang Kim

Jae Hyuk Kim

Do W Lee

Jeong Bong Park

Se Hwan Bong

Do Seop Hwang

Hee Soo Yoon

Kyoung Hoon Kim

Dong Gun Kim

Mi Jin Park

Oh Byoung Kwon

Kyung Pyo Hong

Shin Young Cheong

Woo Sup Kim

Seung Hyun Ra

Ji Hee Moon

Po Cheon Kim

Tae Ho Song

Jun Ho Yun

Hye Won Ryoo

Mi Ok Park

Kyu Ho Lee

Hae Jun Park

Jung Ug An

Myung Ki Lee

Wan Hee Choi

Man Su Kim

Mi Suk Lee

Eon Ju Noh

Mi Kyeong Kim

A multilayer electronic component includes: a body including a plurality of dielectric layers and internal electrodes disposed to face each other with each of the plurality of dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and disposed on outer surfaces of the body, wherein each of the plurality of dielectric layers includes a BaTiO-based base material main component and an accessory component including dysprosium (Dy) and terbium (Tb), a content of terbium (Tb) is 0.2 mol or more and less than 1.0 mol based on 100 mol of the base material main component, and the dielectric layer includes a plurality of dielectric crystal grains having a particle size of 60 nm or more and 250 nm or less at a point (D50) at which a cumulative volume is 50% in a cumulative particle size distribution according to a particle size distribution system.

Multilayer electronic component

A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

A camera module includes a housing, a lens holder configured to move in the housing in an optical axis direction, and a lens barrel coupled to the lens holder, wherein the lens holder includes a first support structure extending from one side surface in the optical axis direction and a second support structure located on a side surface opposite to the first support structure and extending in the optical axis direction, and the first support structure includes an extension protruding beyond the second support structure in the optical axis direction.

Camera module

A camera module includes a housing, and a reflective module changing a direction of light incident on the housing. The reflective module includes a first reflective member having a reflective surface, a holder fixedly coupled to the first reflective member, a first magnetic member mounted on the holder, and a second magnetic member mounted in the housing, facing the first reflective member, and spaced apart from the first magnetic member.

Camera module and structure to switch light path

A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.

A multilayer ceramic capacitor includes a ceramic body including a plurality of dielectric layers stacked therein in a stacking direction; first and second external electrodes disposed externally on the ceramic body; first and second internal electrodes alternately stacked with the plurality of dielectric layers, forming an internal active layer of the ceramic body, and respectively connected to the first and second external electrodes; a dummy layer, including a conductive material and having a mesh shape, disposed in at least one of an upper cover layer or a lower cover layer respectively disposed above or below the internal active layer of the ceramic body in the stacking direction.

Multilayer ceramic capacitor having dummy pattern

A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0&#x3c;tb&#x3c;150 &#x3bc;m+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.

Multilayer ceramic electronic component

A multilayer capacitor includes a capacitor body, a first external electrode, and a second external electrode. The capacitor body includes a plurality of first and second internal electrodes alternately stacked with dielectric layer interposed therebetween. The first and second external electrodes are electrically connected to the first and second internal electrodes, respectively. A first Schottky layer is Schottky-junctioned to an interface between the dielectric layer and the first internal electrode in the capacitor body. A second Schottky layer is Schottky-junctioned to an interface between the dielectric later and the second internal electrode in the capacitor body. The work function values of the first and second Schottky layers is higher than the work function values of the first and second internal electrodes.

Multilayer capacitor

A multilayer ceramic capacitor includes a body, and first and second external electrodes respectively disposed on opposing surfaces of the body in a longitudinal direction. The body includes a capacitive portion including an internal electrode layer including first and second internal electrodes respectively exposed to the opposing surfaces of the body in the longitudinal direction and a floating electrode layer including a floating electrode, the internal electrode layer and the floating electrode layer being alternately stacked with a first dielectric layer interposed therebetween, a cover part disposed on the capacitive portion and having stacked second dielectric layers, a dummy part disposed below the capacitive portion and including a dummy electrode layer including a dummy electrode and a third dielectric layer, the dummy electrode layer and the third dielectric layer being alternately stacked, and an identification layer disposed below the dummy part and having a color distinguished from the cover part.

Multilayer ceramic capacitor

A multilayer electronic component includes a multilayer capacitor including a pair of external electrodes respectively formed on both ends opposing each other, and a pair of frame terminals having coupling holes allowing the external electrodes of the multilayer capacitor to be inserted, and separating the multilayer capacitor from a mounting surface, wherein band portions of the external electrodes are bonded to inner surfaces of the coupling holes.

A multilayer ceramic electronic component includes: a ceramic body including a capacitance forming part in which first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body. The capacitance forming part includes first and second internal electrodes, first floating electrodes, and second floating electrodes. The ceramic body further includes a protective part having third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed and a third dummy electrode is disposed between the first and second dummy electrodes.

Multilayer ceramic electronic component and board having the same

An electronic component includes a body including a dielectric material and an internal electrode embedded in the dielectric material, an external electrode disposed on the body and connected to the internal electrode, and a conductive adhesive connected to the external electrode. The external electrode and the conductive adhesive include a conductive resin. A circuit board includes the electronic component.

Electronic component and circuit board having the same

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Suwon-si, South Korea

Kyeong Jun Kim