Valeo Equipements Electriques Moteur

Valeo Etudes Electroniques

Ky Lim Tan

Jean-Michel Morelle

Laurent Vivet

Sandra Dimelli

Stéphane Thomelin

Patrick Dubus

Hérve Lorin

Hervé Lorin

Olivier Leloup

Said electronic power module () includes: a stack () comprising a metal layer forming an electric circuit () and intended for supporting an electronic power component () such as a semiconductor; a metal body forming a heat drain (); and a dielectric material layer () forming an electric insulator and inserted between the electric circuit () and the heat drain (). The stack () includes a composite material body () having a carbon-charged metal matrix. The carbon charge is between 20 and 60 volume percent. Said composite body () is inserted between an area of the electric circuit () and the electric insulator (), said area being intended for supporting the electronic power component ().

Electronic power module, and method for manufacturing said module

The invention relates to a power module (), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (), each chip having a first surface () to be connected to a heat sink substrate (), and a second surface () separate from the first and on which at least one electronic component (-) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.

Power module for an automobile

Growing community of inventors

Maisons-Alfort, France

Ky Lim Tan