Samsung Electronics Co., Ltd.

Ky-Hyun Jung

Ho-Geon Song

Jun-Young Ko

Heui-seog Kim

Wha-su Sin

Sang-jun Kim

Jae-Yong Park

Hwang-Bok Ryu

A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck portion on the preliminary compressed ball using the preliminary compressed ball and the wire. The capillary may be moved obliquely and downwardly to form a compressed ball. The capillary may extend the wire from the compressed ball to a second pad.

Method of forming at least one bonding structure

A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.

Printed circuit board and method thereof and a solder ball land and method thereof

A contact pin a connection device, and a method of testing. The contact pin may include a barrel (for example, a cylindrical barrel) having a screw thread on an inside wall, a contact tip formed at an end of the barrel, a spring located inside the barrel and having an end connected to the contact tip, a plunger formed at the other end of the barrel and connected to the other end of the spring, and at least one screw moving together with the screw thread. The plunger and/or the contact tip may have at least one screw, moving together with the screw thread.

Contact pin, connection device and method of testing

Growing community of inventors

Cheonan-si, South Korea

Ky-Hyun Jung