Korea Electronics Technology Institute

Kwonwoo Shin

Jinwoo Cho

Yoonjin Kim

Yonggon Seo

Yeonwon Kim

Sanghyeon Jang

Namje Jo

Jisun Park

The present disclosure relates to a heating paste composition which has heat stability, allows screen printing and gravure printing, has a small change in resistance depending on temperature, and can operate at low voltage and low power due to low specific resistance, to a surface type heating element using the same, and to a portable low-power heater. The heating paste composition may contain conductive particles including carbon nanotube particles and carbon nanoparticles, a mixture binder including epoxy acrylate or hexamethylene diisocyanate, a polyvinyl acetal and a phenol-based resin, an organic solvent, and a dispersant.

Heating paste composition, surface type heating element using the same, and portable low-power heater

The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.

Ink composition for light sintering, wiring board using same and manufacturing method therefor

The present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.

The present invention relates to a photosensitive coating composition, a conductive coating film using the photosensitive coating composition, and a method for forming the conductive coating film. The present invention provides photosensitive coating composition for forming a conductive coating film, the composition containing a conductive nanomaterial and a photosensitive material. Further, the present invention provides a conductive coating film formed on a substrate, the conductive coating film formed using a photosensitive coating liquid. Here, after the photosensitive coating liquid is coated on the substrate, an exposed region and a non-exposed region are formed by exposure and washing, wherein the non-exposed region has at least two times the conductivity of the exposed region.

Growing community of inventors

Hwaseong-si, South Korea

Kwonwoo Shin