Samsung Electronics Co., Ltd.

Kwon-Young Roh

Kyung-Lae Jang

Dong-Suk Kim

A semiconductor package on package includes a tower package, an upper package stacked over the lower package, a plug wire combined to any one of an upper portion of the tower package and a lower portion of the upper package, and a socket wire combined to any one of the upper portion of the lower package and the lower portion of the upper package. The plug wire is plugged into the socket wire to electrically connect the upper and lower packages.

Semiconductor package on package having plug-socket type wire connection between packages

A semiconductor package comprises a semiconductor chip and a printed circuit board. The printed circuit board comprises a board body. An upper wiring layer is formed on the upper surface of the board body and includes a chip-mounting portion for mounting the semiconductor chip, board pads formed around the chip-mounting portion and electrically connected to said semiconductor chip, and an upper heat dissipation layer around said chip-mounting portion. Further, a lower wiring layer including a lower heat dissipation layer is formed on the lower surface of the board body. First heat-dissipating via holes are formed through the board body between the chip-mounting portion and the lower heat dissipation layer and are filled with a thermally conductive material for dissipating heat from the chip through the board body to the lower wiring layer. Second heat-dissipating via holes are formed through the board body below said upper heat dissipation layer and are filled with a thermally conductive material for dissipating heat generated from the chip through the board body to the upper heat dissipation layer.

Growing community of inventors

Seoul, South Korea

Kwon-Young Roh