Cheil Industries Inc.

Samsung Sdi Co., Inc.

Cheil Industry, Inc.

Kwen-Woo Han

Han-Song Lee

Sang-Kyun Kim

Jin-Hee Bae

Taek-Soo Kwak

Eun-Su Park

Bo-Sun Kim

Byeong-Gyu Hwang

Jin-Woo Seo

Hyun-Ji Song

Youn-Jin Cho

Seung-Hee Hong

Yoong-Hee Na

Go-Un Kim

Wan-Hee Lim

Jae-Hyun Kim

Hyeon Cheol Park

Mi-young Kim

Jaeyeol Baek

Jun-Young Jang

Eui-June Jeong

Hui-Chan Yun

Soonhyung Kwon

Shinhyo Bae

Yoojeong Choi

Sang-Hak Lim

Mi-Young Kim

Bong-Hwan Kim

Sae-Mi Park

Woo-Jin Lee

Beomjun Joo

Jong-seob Kim

Jung-Hyun Cho

Chang-Min Lee

Jung-Sik Choi

Kil-Sung Lee

Jinwoo Seo

Jong-Seob Kim

Jiho Lee

Nam-Gwang Kim

Kunbae Noh

Se-Young Choi

Taeksoo Kwak

Huichan Yun

Jun Sakong

Jin-Wook Lee

Jingyo Kim

Sun-Hae Kang

Junyoung Jang

Sooyeon Sim

Tu-Won Chang

O-Bum Kwon

Byeong Gyu Hwang

Yonggoog Kim

Jong-Dae Jeon

Hyun-Hoo Sung

Seul-Young Jeong

Yoonyoung Koo

Provided is a composition for forming a silica layer, the composition containing a silicon-containing polymer and a solvent, wherein a silica layer formed of the composition for forming the silica layer satisfies Relation 1. The definition of Relation 1 is as described in the specification. The definition of Relation 1 is the same as described in the specification.

Composition for forming silica layer, manufacturing method for silica layer, and silica layer

A resist underlayer composition and a method of forming patterns, the composition including a solvent; and a polymer that includes a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, 

Resist underlayer composition, and method of forming patterns using the composition

A resist underlayer composition and a method of forming patterns using the resist underlayer composition, the resist underlayer composition including a polymer including a moiety represented by Chemical Formula 1 and a moiety represented by Chemical Formula 2, and a solvent, 

A composition for forming a silica based layer includes a silicon-containing compound including polysilazane, polysiloxazane, or a combination thereof and one or more kinds of solvent, and having a turbidity increasing rate of less than or equal to about 0.13.

Composition for forming a silica based layer, method for manufacturing silica based layer, and electronic device including the silica based layer

A composition for forming a silica based layer and a method for manufacturing a silica based layer, the composition including a silicon-containing compound, the silicon-containing compound including a hydrogenated polysilazane moiety, a hydrogenated polysiloxazane moiety, or a combination thereof, and a solvent, wherein a number of particles of the silicon-containing compound in the composition and having a particle diameter of about 0.2 &#x3bc;m to about 1 &#x3bc;m is less than or equal to about 10/ml.

Composition for forming silica based layer, and method for manufacturing silica based layer

Disclosed is modified hydrogenated polysiloxazane prepared by reacting hydrogenated polysiloxazane with a silane compound selected from polysilane, polycyclosilane, and a silane oligomer. The modified hydrogenated polysiloxazane has a small mole ratio of nitrogen atoms relative to silicon atoms and may remarkably deteriorate a film shrinkage ratio when included in a composition for forming a silica-based insulation layer to form a silica-based insulation layer.

Modified hydrogenated polysiloxazane, composition comprising same for forming silica-based insulation layer, method for preparing composition for forming

Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.

Composition for forming silica-based insulating layer, method for preparing composition for forming silica-based insulating layer, silica-based insulating layer, and method for manufacturing silica-based insulating layer

A rinse liquid for an insulation layer, the rinse liquid including a solvent represented by the following Chemical Formula 1: 

Rinse liquid for insulating film and method of rinsing insulating film

A resist underlayer composition includes a solvent, and an organosilane condensation polymerization product of: a compound represented by the following Chemical Formula 1, a compound represented by the following Chemical Formula 2, and a compound represented by the following Chemical Formula 3,[RO]Si&#x2014;X&#x2003;&#x2003;[Chemical Formula 1][RO]Si&#x2014;R&#x2003;&#x2003;[Chemical Formula 2][RO]Si&#x2014;Si[OR].&#x2003;&#x2003;[Chemical Formula 3]

Resist underlayer composition and process of producing integrated circuit devices using the same

A resist underlayer composition, including a solvent, and an organosilane condensation polymerization product of hydrolyzed products produced from a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, and a compound represented by Chemical Formula 3.

Resist underlayer composition and process of producing integrated circuit devices using same

Disclosed is a resin composition for a protective layer of a color filter including an acrylate-based resin including a repeating unit represented by each of Chemical Formulae 1 to 3, a melamine-based resin represented by Chemical Formula 4, a thermal acid generator (TAG), and a solvent.

Resin composition for protection layer of color filter, protection layer of color filter using same and image sensor including same

The present invention provides a photosensitive resin composition for a pad protective layer that includes (A) an alkali soluble resin, (B) a reactive unsaturated compound, (C) a photoinitiator, and (D) a solvent. The (A) alkali soluble resin includes a copolymer including about 5 to about 50 wt % of a unit having the Chemical Formula 1, about 1 to about 25 wt % of a unit having the Chemical Formula 2, and about 45 to about 90 wt % of a unit having the Chemical Formula 3, and a method of making an image sensor using the photosensitive resin composition.

Photosensitive resin composition for pad protective layer, and method for making image sensor using the same

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Suwon-si, South Korea

Kwen-Woo Han