Semes Co., Ltd.

Kwangsup Kim

Kihoon Choi

Jihoon Park

Yoon Jong Ju

Ji Hoon Yoo

Do Heon Kim

Minyoung Kim

Myeong Jun Lim

Doyeon Kim

Choonghyun Lee

Soo Ill Jang

Hanglim Lee

Jungsuk Goh

Dongok Ahn

Junho Oh

Hyo Seok Lee

Keunhwa Yang

Yungi Kim

Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.

Die bonding apparatus and method and substrate bonding apparatus and method

An inspection module is disclosed for inspecting a droplet from an ink jet head. The inspection module includes a sensor located under the ink jet head and measuring a distance between the droplet and the sensor in real time; a variable lens changing an operating distance based on the measured distance of the sensor; and a camera for capturing an image of the droplet. The inspection module further includes a droplet inspecting part inspecting the droplet image captured by the camera.

Droplet inspection module and droplet inspection method

Disclosed are a substrate treating apparatus and a method for inspecting a treatment liquid nozzle. The substrate treating apparatus includes a support member configured to support a substrate, a treatment liquid nozzle configured to discharge a treatment liquid to the substrate located on the support member, a light source configured to irradiate light to a point of the substrate, to which the treatment liquid is discharged, a camera configured to photograph the point of the substrate, to which the treatment liquid is discharged, and a controller configured to determine, through an image captured by the camera, whether a crown is generated when the treatment liquid collides with the substrate.

Substrate treating apparatus and method for inspecting treatment liquid nozzle

A substrate treating apparatus includes a treatment unit including a container, and a support member in the interior of the container to support a substrate, the treatment unit being configured to treat the substrate a nozzle unit having a treatment liquid nozzle for supplying a treatment liquid to the substrate provided in the treatment unit and an inspection unit that inspects whether the treatment liquid is normally discharged from the treatment liquid nozzle. The nozzle further includes a nozzle driver that moves the treatment liquid nozzle from a process position at which the substrate is treated by the treatment unit and an inspection position at which the treatment liquid nozzle is inspected by the inspection unit.

Inspection unit, inspection method, and substrate treating apparatus including the same

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Chungcheongnam-do, South Korea

Kwangsup Kim