Samsung Electronics Co., Ltd.

KwangSoo Park

Jiwoon Park

Joon Ki Paek

Heeju Kim

Su-Jin Kim

Youngsoo Jang

Jae-Sang Yun

Heesu Kim

Yongha Kim

Junsik Park

Bonggyu Kang

Kyoungsub Oh

Jaehyurk Choi

A semiconductor package includes a package board, at least one semiconductor chip disposed on the package board, a molding member disposed on the package board and at least partially surrounding the at least one semiconductor chip, and a heat dissipation member disposed on the at least one semiconductor chip and the molding member. The molding member has first region in which a plurality of uneven structures are disposed, and a second region spaced apart from an external region by the plurality of uneven structures. The plurality of uneven structures protrude to a predetermined height away from the semiconductor chip, the molding member, and the heat dissipation member, and may be formed as a part of the head dissipation member, or formed separately.

Semiconductor package including uneven structures and electronic device including the same

Disclosed is an electronic device which includes a plurality of memory devices, a memory controller, a first signal line that makes electrical connection between the memory controller and a first branch point, a second signal line that makes electrical connection between the first branch point and a second branch point, a third signal line that makes electrical connection between the first branch point and a third branch point, a fourth signal line that electrically connects the second branch point and the first memory device, a fifth signal line that electrically connects the second branch point and the second memory device, a sixth signal line that electrically connects the third branch point and the third memory device, and a stub that includes a first end electrically connected with at least one of the plurality of signal lines, and a second end being left open-circuit.

Electric device including branched signal lines, and electric device including printed circuit board

A transmitter includes output drivers respectively corresponding to data transmission lines, driver control logic configured to control the output drivers in response to data pattern information, and a data pattern detector configured to detect a data pattern in relation to at least two data transmission lines among the data transmission lines over a predetermined period of time, and output the data pattern information corresponding to the data pattern.

Transmitter, data communication device including same, and data transmission method

A printed circuit board may include a controller socket, first and second sockets provided on a top surface, third and fourth sockets provided on a bottom surface, and first, second, and third branching points. The first branching point may be spaced apart from the controller socket by a first distance in a horizontal direction parallel to the top surface and may be electrically connected to the controller socket. The second branching point may be spaced apart from the first branching point by a second distance longer than the first distance and may be electrically connected to the first branching point, the first and third sockets. The third branching point may be spaced apart from the first branching point by a third distance longer than the first distance and may be electrically connected to the first branching point, the second and fourth sockets.

Printed circuit board and storage device including printed circuit board

A nonvolatile memory system can include a nonvolatile memory device that can be configured to store data and a nonvolatile memory buffer circuit that can be configured to store data of a type that is predetermined to be flushed to the nonvolatile memory device in a sudden power off backup operation of the nonvolatile memory system, whereas a volatile memory buffer circuit can be configured to store other data of a type that is not to be flushed to the nonvolatile memory device in the sudden power off backup operation of the nonvolatile memory system. A memory controller can be coupled to the nonvolatile memory device, the nonvolatile memory buffer circuit, and to the volatile memory buffer circuit, where the memory controller can be configured to store received data or processed data in the nonvolatile memory buffer circuit responsive to determining that the received data or processed data is of the type that is predetermined to be flushed to the nonvolatile memory device in the sudden power off backup operation of the nonvolatile memory system.

Memory systems including nonvolatile buffering and methods of operating the same

A Solid State Disk (SSD) includes a plurality of nonvolatile memory devices storing data, and an embedded solid state disk controlling the plurality of nonvolatile memory devices. The SSD uses an embedded SSD (eSSD) as a controller. Thus, the SSD can be embodied in a small area. Also, since the SSD does not need an additional process for manufacturing a controller, manufacturing cost per unit may be reduced.

Embedded solid state disk as a controller of a solid state disk

A circuit can include a supercapacitor switch including first and second terminals, that is configured to electrically couple the terminals to one another in a closed position and to electrically de-couple the terminals from one another in an open position responsive to a supercapacitor switch control signal. A first supercapacitor has a first terminal that is electrically coupled to the first terminal of the supercapacitor switch and has a second terminal that is electrically coupled to a reference voltage. A second supercapacitor has a first terminal that is electrically coupled to the second terminal of the supercapacitor switch and has a second terminal that is electrically coupled to the reference voltage.

Growing community of inventors

Suwon-si, South Korea

KwangSoo Park