Samsung Electronics Co., Ltd.

Kwangsic Choi

Kihuk Lee

Jungsoo Kim

Hwajoong Jung

Manho Kim

Jongwan Shim

Wonjun Jeong

Taeyun Kim

Keonyoung Seo

Minki Cho

Dohyun Ahn

Wonchul Cho

Jaemin Ryoo

Chonguk Heo

A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed circuit board, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.

Camera module for heat dissipation and ground and electronic device including the same

A flexible printed circuit board that includes a signal transmission part that is disposed in a first direction and that includes a signal line that transmits an electrical signal and a ground part disposed in a second direction. The ground part includes a conductive adhesive layer disposed in the first direction and the conductive adhesive layer includes a plurality of conductive balls having electrical conductivity. Various other embodiments are disclosed in the specification.

Flexible printed circuit board and electronic device including the same

Growing community of inventors

Suwon-si, South Korea

Kwangsic Choi