Amkor Technology, Inc.

KwangSeok Oh

Roger D St Amand

August Joseph Miller, Jr

Alexander William Copia

A stacked inverted flip chip package includes a substrate having a secondary electronic component opening and first traces. Primary flip chip bumps electrically and physically couple a primary electronic component structure to the substrate. Secondary flip chip bumps electrically and physically couple an inverted secondary electronic component to the primary electronic component structure between the primary electronic component structure and the substrate and within the secondary electronic component opening. By placing the secondary electronic component between the primary electronic component structure and the substrate, the height of the stacked inverted flip chip package is minimized.

Growing community of inventors

Gyeonggi-do, South Korea

KwangSeok Oh