Intel Corporation

Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Kwangmo Chris Lim

Ji Young Chung

Tae Kyeong Hwang

Dae Gon Kim

Hwan Kyu Kim

Aleksandar Aleksov

Srinivas V Pietambaram

Kristof Darmawikarta

Robert Alan May

Sri Ranga Sai Boyapati

Javier Soto Gonzalez

Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Method of manufacturing an electronic device and electronic device manufactured thereby

Integrated circuit package substrates with high-density interconnect architecture for scaling high-density routing, as well as related structures, devices, and methods, are generally presented. More specifically, integrated circuit package substrates with fan out routing based on a high-density interconnect layer that may include pillars and vias, and integrated cavities for die attachment are presented. Additionally, integrated circuit package substrates with self-aligned pillars and vias formed on the high-density interconnect layer as well as related methods are presented.

Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling

Growing community of inventors

Seoul, South Korea

Kwangmo Chris Lim