Samsung Electronics Co., Ltd.

Kwangkyu Bang

Minseok Kim

Jaegyu Choi

Yun Chang

Kiljoong Yun

Yusuf Cinar

Jihong Kim

Kyungjae Kim

Heeyoub Kang

Sunki Yun

Eunji Yu

Kyungduk Lee

Young-Seop Shim

Jooyoung Kim

Kitaek Lee

Sanggeun Yoo

Songrye Choi

HyoJae Bang

Kiyhun Choi

A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.

Module substrate for semiconductor module, semiconductor module and test socket for testing the same

A test socket includes: a first body including a fixing portion configured to receive a sample having a plurality of test terminals; a second body facing the first body and coupled with the first body such that the second body rotates relative to the first body about a hinge pin; a test board provided on the second body and configured to test the sample, wherein the test board has a plurality of first openings provided therein; and a plurality of interface pins penetrating through the first openings, wherein each of the plurality of interface pins includes a contact pin and a spring, wherein the contact pin is provided in a first end portion of each of the plurality of interface pin and is configured to come into contact with a test terminal of the plurality of test terminals, and the spring elastically supports the contact pin.

Test socket for performing a test on an electronic device

A storage device testing module includes a plate and a test board disposed on the plate and including a storage device receiver, the storage device receiver receiving a storage device to be tested. The storage device testing module further includes a sensor including a plurality of switches disposed on an inner surface of the storage device receiver, the plurality of switches being activated by movement of the storage device into the storage device receiver. The storage device testing module further includes a plurality of plungers disposed on the inner surface, contacting and supporting the storage device.

Storage device testing module

A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

Module substrate and semiconductor module including the same

A method of operating a storage device includes sensing a standby current flowing through the storage device, determining based on the sensed standby current and at least one reference value whether a product abnormality has occurred within the storage device, and when it is determined the product abnormality has occurred, performing a step-wise control operation in which two or more control processes associated with an operation of the storage device are sequentially executed.

Method of operating storage device for improving reliability, storage device performing the same and method of operating storage using the same

An operating method of a memory controller to control a nonvolatile memory device includes receiving information about operation failure from the nonvolatile memory device, receiving lock-out status information from the nonvolatile memory device, determining whether a lock-out signal is output based on the lock-out status information, and determining a failure block corresponding to the information about the operation failure as a normal block or a bad block depending on the determination result.

Operating method of memory controller, storage device including the same, and operating method of storage device

A storage device may include a nonvolatile memory including a plurality of memory blocks and a memory controller configured to determine a comparison between an idle current value of the nonvolatile memory and a reference current value and to adjust, based on the comparison, a start temperature at which the storage device begins operating speed control of the storage device.

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Hwaseong-si, South Korea

Kwangkyu Bang