Samsung Electronics Co., Ltd.

Kwangjin Bae

Ji-Yong Park

Soyoung Lim

Sang-Gui Jo

Byounguk Yoon

Jongchul Choi

Seunghoon Lee

Heecheul Moon

Minsung Lee

Iksu Jung

Uyhyeon Jeong

Howon Lee

Hyunmi Cheong

Hyun-Mi Cheong

Jaeshik Kim

Hongmoon Cheon

Jungnam Moon

An electronic device includes a housing having a mounting portion to which a battery is mountable; and the battery mounted to the mounting portion, wherein the battery includes: a battery pouch comprising at least one conductive terminal exposed to the outside; a circuit board electrically connected to the exposed at least one conductive terminal and having at least one circuit element mounted thereon to electrically protect the battery pouch; a case including a first plate and a lateral plate extended to be bent from the first plate, wherein the circuit board is disposed in a space surrounded by the first plate and the lateral plate, and the first plate protrudes further than the accommodated circuit board in an opposite direction of a lateral wall of the battery pouch.

Protective circuit module case of battery and electronic device including the same

A mobile terminal case and a method of manufacturing the same are provided. The mobile terminal case includes a three-dimensional curved body or plane shape having a circumferential edge lower than its center and formed from a fiber reinforced composite material; and a gradation paint layer formed at an outer surface of the body formed from fiber reinforced composite material.

Mobile terminal case and method of manufacturing the same

An electronic device with a cover including glass is provided. The electronic device includes a housing having at least one coupling recess which is formed on the edge of the housing, a cover body configured to cover one surface of the housing, a coupling member coupled to the cover body configured to make the cover body detachable from/attachable to the at least one coupling recess, and a glass member attached to one surface of the cover body.

Cover including glass and electronic device using the same

A waterproof ear jack socket includes: an upper socket having at least one slit formed such that a first portion of a contact terminal passes through one surface of the upper socket to be exposed to the outside; a lower socket having a recess for engaging a second portion of the contact terminal on one surface thereof facing the upper socket, the lower socket being coupled to the upper socket to form a plug insertion hole into which an ear jack plug is inserted; and a waterproof cover attached to an outer circumference of a socket body formed by coupling the upper socket and the lower socket.

Waterproof ear jack socket and method of manufacturing the same

A semiconductor package includes a base substrate, a semiconductor chip mounted on the base substrate and including bonding pads, first and second connection terminals disposed adjacent to the semiconductor chip on the base substrate and electrically connected to the bonding pads, a first ball land disposed on the base substrate and electrically connected to the first connection terminal, a second ball land spaced apart from the connection terminals, the first ball land disposed between the second ball land and at least one of the first and second connection terminals, a first insulating layer covering the first ball land but exposing at least a part of the second ball land, and a first conductive wire extending onto the first insulating layer and connecting the second connection terminal to the second ball land.

Method of fabricating semiconductor package having substrate with solder ball connections

Semiconductor package having substrate with solder ball connections and method of fabricating the same

Growing community of inventors

Suwon-si, South Korea

Kwangjin Bae