Samsung Electronics Co., Ltd.

Kwangho Park

Jaehoon Kim

Seungjae Jung

Hyunji Song

Yonghoon Son

Gyeonghee Lee

An integrated circuit device includes a plurality of semiconductor layers stacked on a substrate to overlap each other in a vertical direction and longitudinally extending along a first horizontal direction. The plurality of semiconductor layers may have different thicknesses in the vertical direction.

Method of manufacturing integrated circuit device

A semiconductor memory device, including a first semiconductor pattern, and a second semiconductor pattern separated from the first semiconductor pattern in a vertical direction; a first bit line electrically connected to a first source/drain region of the first semiconductor pattern, and a second bit line electrically connected to a first source/drain region of the second semiconductor pattern; a word line structure in contact with the first semiconductor pattern and the second semiconductor pattern; and a first data storage element electrically connected to a second source/drain region of the first semiconductor pattern, and a second data storage element electrically connected to a second source/drain region of the second semiconductor pattern, wherein the first semiconductor pattern and the second semiconductor pattern are monocrystalline, and wherein a crystal orientation of the first semiconductor pattern is different from a crystal orientation of the second semiconductor pattern.

Semiconductor memory device

Integrated circuit device and method of manufacturing the same

Growing community of inventors

Cheonan-si, South Korea

Kwangho Park