Samsung Electro-Mechanics Co., Ltd.

Other

Kwang Yun Kim

Seung Eun Lee

Yong Hoon Kim

Jun Oh Hwang

Ki Jung Sung

Myeong Hui Jung

A printed circuit board (PCB) includes a substrate including a first insulating layer and first wiring patterns disposed on the first insulating layer, an optical sensing chip including a vertical cavity surface emitting laser (VCSEL) and a photodiode, disposed on the first insulating layer to be in contact with at least one of the first wiring patterns, a transimpedance amplifier (TIA) chip disposed to be spaced apart from the optical sensing chip on the first insulating layer and disposed to be in contact with at least one first wiring pattern, different from the first wiring pattern connected to the optical sensing chip, among the first wiring patterns, and a dielectric layer stacked on the substrate and having a hole exposing the VCSEL and the photodiode of the optical sensing chip. The optical sensing chip and the transimpedance amplifier chip are connected through a wiring pattern disposed on the dielectric layer.

Printed circuit board and printed circuit board package

The present disclosure relates to a printed circuit board and a module including the same. The printed circuit board includes an insulating body, a wiring pattern embedded in the insulating body, and a first conductor pattern disposed on the insulating body and overlapping at least a portion of the wiring pattern in a first direction. First conductive vias each penetrate a portion of the insulating body and are respectively disposed on opposite sides of the wiring pattern, in a second direction orthogonal to the first direction, to surround at least a portion of the wiring pattern. Each first conductive via has a first surface connected to the first conductor pattern, and a second surface, opposite to the first surface, connected to the insulating body.

Printed circuit board and antenna module comprising the same

There is provided a fan-out semiconductor device in which a first package having a semiconductor chip disposed therein and having a fan-out form and a second package having a passive component disposed therein and having a fan-out form are stacked in a vertical direction so that the semiconductor chip and the passive component are electrically connected to each other by a path as short as possible.

Fan-out semiconductor device

A roller-type bill counter comprising a counter body having, at the front thereof, an upper bill inlet opening and a lower bill outlet opening, and a frictional plate disposed within said counter body and adapted to frictionally contact with and lead each bill to be counted from said upper bill inlet opening to said lower bill outlet opening. In accordance with the present invention, the bill counter comprises a shield plate mounted on the upper portion of the lower bill outlet opening, in order to prevent the generated dust and stench from being discharged through the lower bill outlet opening. A plurality of apertures perforated through the frictional plate. A fan mounted on the bottom of the counter body in order to suck the dust and stench through said apertures of the frictional plate. An air-permeable fabric filter pocket separately mounted, at the upper end, on the discharging end of said fan and adapted to collect the dust therein.

Growing community of inventors

Suwon-si, South Korea

Kwang Yun Kim