Arcsoft Corporation Limited

Kwang Sue Park

Byung Il Min

Dong Wook Nam

Bong Seok Kim

Semiconductor package having self-aligned structure disclosed. Semiconductor package includes a semiconductor chip having an active area and at least one marginal area that is located around the active area, wherein at least one alignment bar is arranged on the marginal area and a top structure being arranged on the semiconductor chip and having a groove being formed on a bottom surface, wherein the groove is configured for accommodating the alignment bar.

Semiconductor package having self-aligned structure

A fingerprint sensor is disclosed. An embodiment according to an aspect of the present invention provides a display having a fingerprint recognition function. The display having a fingerprint recognition function may comprise: a display panel, which is disposed under a cover glass and allows rays to pass therethrough, the rays having various incident angles indicating ridges and troughs of a fingerprint that is in contact with the cover glass; and an image sensor layer, which is disposed under the display panel and detects a ray to be detected in the rays having the various incident angles to generate a fingerprint image.

Display with fingerprint detecting sensor below display panel

A semiconductor package including a prism sheet having dam structure disclosed. The semiconductor package includes a case having a wall configured for surrounding a space in which a semiconductor chip is installed, and a prism sheet having a prism surface consisting of a plurality of prism peaks and a plurality of prism valleys and a flat surface facing the prism surface, wherein the prism surface faces the semiconductor chip and the flat surface is coupled to a cover, wherein a dam extending in a direction different from an extending direction of the prism peak is formed on the prism surface.

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Seoul, South Korea

Kwang Sue Park