Samsung Electronics Co., Ltd.

Kwang-Su Yu

Dong-chun Lee

Dong-Woo Shin

Seong-Chan Han

Hyo-Jae Bang

Byung-Man Kim

Jung-Hoon Kim

Young-Soo Lee

Ho-Geon Song

Hyun-Seok Choi

Yong-Hyun Kim

Jae-Seon Hwang

Si-Suk Kim

A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage.

Test socket for testing electrical characteristics of a memory module

Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.

Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly

Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

Printed circuit board of semiconductor package and method for mounting semiconductor package using the same

A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the first chip package and the module board and a protector for applying pressure to the conductive element, the module board, and the first chip package and/or acting as a heat sink for the first chip package.

Semiconductor module with conductive element between chip packages

An open socket, into which a module can be inserted, may include: a body into which the module is insertable; a pin to contact an electrical connection member of the inserted module, the pin serving as at least a part of an electrical signal path to/from the module upon insertion thereof; an elastic biasing member to exert an elastic biasing force to cause the pin to contact the module; and at least one lower support to limit insertion depth as being a depth at which a lower portion of the inserted module comes to rest upon the at least one lower support; the body and the at least one lower support being constructed and arranged to provide a gap adjacent the at least one support, which leaves an area of the socket underlying the lower portion of the inserted module open to the outside.

Growing community of inventors

Cheonan-si, South Korea

Kwang-Su Yu