Samsung Electronics Co., Ltd.

Kwang-Soo Jung

Seung-hoon Han

Dong-Won Lee

Myung-Sik Kim

Dong-Chang Lee

Sang-Ki Kang

Seung-soo Kang

Jung-Han Kim

Hoon-Do Heo

Ki-Choon Gong

Gun-Yong Lee

Tae-Won Do

Bo-Seok Moon

Gang-Youl Yu

Haeng-Il Kim

Byeong-Cheol Yoon

Seung-Soo Kang

According to embodiments of the present disclosure, there are disclosed a touch panel and electronic device having the touch panel. The touch panel, comprises a first layer having a plurality of first conductive sensors disposed below a window member; and a second layer spatially separated from the first layer and having a plurality of second conductive sensors, the first conductive sensors and the second conductive sensors being respectively positioned at different locations in a plane of the touch panel, wherein the second layer is disposed below the first layer, and the both layers are disposed over a display unit or at least one of both layers are integrated with the display unit.

Touch panel and electronic device having the same

A method and an apparatus perform a video call service. A transmission communication device provides information on a rotation angle of a video call image transmitted during a video call to a reception communication device corresponding to a counterpart of the video call. Then, the reception communication device renders the received video call image by using the information on the rotation angle of the received video call image, and displays a rendered video call image. Accordingly, an image of a counterpart of the video call can be normally provided during the video call.

Method and apparatus for providing a video call service

A printed circuit board and a pad apparatus having a solder deposit formed on the pad apparatus by using a mask having a slit are provided. The slit has the same shape as the solder deposit. The solder deposit includes first and second end portions individually shaped and sized to completely cover at an end portion of the pad a predetermined area of an end portion of the pad, the area defined by both the entire width of the pad and a predetermined length from the end of the pad. A connection web extends between the two end portions to integrate the two end portions into a single structure and is a longitudinal part having a width smaller than any one of both the width of the pad and the width of each of the two end portions. First and second trapezoidal portions are respectively formed at junctions between opposite ends of said connection web and one of the two end portions. The mask has a slit formed at a position corresponding to the position of the solder deposit. This slit includes first and second end opening parts corresponding to the two end portions of the solder deposit, a web opening part corresponding to the connection web, and first and second trapezoidal opening parts respectively formed at junctions between opposite ends of said web opening part and said two end opening parts and corresponding to the first and second trapezoidal portions of the solder deposit.

Printed circuit board and pad apparatus having a solder deposit

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Seoul, South Korea

Kwang-Soo Jung