Samsung Electronics Co., Ltd.

Kwang-Jun Yoon

Won Suk Choi

Yong-Won Kim

Hyeong-Cheol Kim

Jae-hyun Jung

Hyoung-Jo Jeon

Hyun-Kwon Jung

Chung-Sam Jun

Sun-Yong Choi

Jun-bo Kim

Koung-Su Shin

Dong-Jin Park

Jae-Wan Kim

Dong-Chun Lee

Seung-Hwan Choi

Kyoung-mu Lee

Hyung-Suck Cho

Young-Jun Roh

For an automatic defect inspection of an edge exposure area of a wafer, an optical unit supplies a light beam onto the edge portion of a wafer and a detection unit detects light reflected from the edge portion. The detection unit converts the detected light into an electrical signal to transmit the electrical signal to a processing unit. The processing unit analyzes the electrical signal to measure the reflectivity of the edge portion, compares the measured reflectivity with a reference reflectivity, and calculates the width of the edge exposure area. The processing unit compares the calculated width with a reference width to detect any defect in the edge exposure area.

Method and apparatus for inspecting an edge exposure area of a wafer

A system and method of measuring a distance of semiconductor patterns is provided. The system includes a microscope and a control unit. The control unit calculates standard coordinates of standard points in view-fields that include spots, spot coordinates of spots with respect to standard points, real coordinates of spots from both of the standard coordinates and spot coordinates, and finally the distance between the two spots from the first and second real coordinates. Coordinates are determined using high magnification, in conjunction with pixel counting, allowing more precise distance measurements.

Systems and methods for measuring distance of semiconductor patterns

A method of reconstructing a tomogram of an X-ray apparatus. The tomogram reconstructing method includes obtaining model information and a transmission image of a subject. A tomogram is reconstructed from the transmission image using the model information. The reconstructed tomogram obtained is then displayed.

Method of reconstructing a tomogram of an X-ray apparatus

Disclosed herein is a battery inspection system. The battery inspection system includes a battery feeding conveyor for feeding batteries to be inspected. One or more transfer robots are positioned near the rear end of the battery feeding conveyor for transferring batteries fed through the battery feeding conveyor to inspection and discharge positions. An X-ray generator is positioned under the transfer robots for applying X-rays to batteries transferred by the transfer robots. A satisfactory battery discharging conveyor is positioned near the transfer robots for discharging satisfactory battery moved by the transfer robots and having been inspected. A defective battery discharging robot is positioned near the front end of the satisfactory battery discharging conveyor for removing defective batteries from batteries moving along the satisfactory battery discharging conveyor and having been inspected.

Battery inspection system

Disclosed herein is a three-dimensional image constructing method using an X-ray apparatus. In the three-dimensional image constructing method, a construction space of a subject and information for the construction space are set. Thereafter, a plurality of transmission images of the subject are obtained. The data of the construction space are calculated on the basis of the information for the construction space set at the setting step and the transmission images obtained at the image obtaining step. The construction space is constructed on the basis of the data calculated at the image processing step.

Three-dimensional image constructing method using X-ray apparatus

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Seoul, South Korea

Kwang-Jun Yoon